Magnetic head manufacturing method forming sensor side wall film by over-etching magnetic shield
US-9196268-B2 · Nov 24, 2015 · US
Magnetoresistive sensor with AFM-stabilized bottom shield
US9251815B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9251815-B2 |
| Application number | US-201313930150-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 28, 2013 |
| Priority date | Jun 28, 2013 |
| Publication date | Feb 2, 2016 |
| Grant date | Feb 2, 2016 |
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Abstract
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An apparatus disclosed herein includes a sensor stack including a first layer and an AFM stabilized bottom shield in proximity to the first layer, wherein the AFM stabilized bottom shield is magnetically coupled to the first layer. The apparatus reduces shield-to-shield spacing. The pinned layer of the bottom shield and a pinned layer of the sensor stack are stabilized using the AFM layer in the bottom shield. In one implementation, the bottom shield is made of the SAF structure, with the top layer of the structure adjacent to a pinned layer in the sensor stack.
First claim
Opening claim text (preview).
What is claimed is: 1. An apparatus comprising: a sensor stack including a pinned layer; and an AFM stabilized bottom shield formed adjacent to the pinned layer of the sensor stack, wherein the AFM stabilized bottom shield is magnetically coupled to the pinned layer of the sensor stack and the AFM stabilized bottom shield includes a top layer of a SAF structure in proximity to the pinned layer of the sensor stack, and a pinned layer of the SAF structure. 2.…
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Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
- G11B5/3912Primary
Physics · mapped topic
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- What does patent US9251815B2 cover?
- An apparatus disclosed herein includes a sensor stack including a first layer and an AFM stabilized bottom shield in proximity to the first layer, wherein the AFM stabilized bottom shield is magnetically coupled to the first layer. The apparatus reduces shield-to-shield spacing. The pinned layer of the bottom shield and a pinned layer of the sensor stack are stabilized using the AFM layer in th…
- Who is the assignee on this patent?
- Seagate Technology Llc
- What technology area does this patent fall under?
- Primary CPC classification G11B5/3912. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Feb 02 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).