Hot-melt adhesive resin film and production method thereof
US-11904577-B2 · Feb 20, 2024 · US
US9249289B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9249289-B2 |
| Application number | US-201314380578-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 12, 2013 |
| Priority date | Feb 24, 2012 |
| Publication date | Feb 2, 2016 |
| Grant date | Feb 2, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Extruded or molded profiles comprising a polyolefin composition consisting of 85% by weight or more of a copolymer of 1-butene with ethylene (A) having an ethylene copolymerized content up to 18% by mol, and having Mw/Mn lower than 3, hardness shore A (measured according to ISO 868) lower than 90, no melting point (TmII) detectable at the DSC after cancelling the thermal history, melting enthalpy (ΔHf), measured by DSC after 10 days of aging at room temperature, comprised between 4 and 15 J/g; and up to 15% by weight of a propylene copolymer or a composition of copolymers of propylene (B) having a melting point from about 126° C. to 200° C., isotactic index greater than 90%.
Opening claim text (preview).
The invention claimed is: 1. An article comprising a polyolefin composition consisting of: A) a copolymer of 1-butene with ethylene having ethylene copolymerized content up to 18% by mol and, wherein component A) has the following properties: a) distribution of molecular weight Mw/Mn equal to or less than 3; b) hardness shore A (measured according to ISO 868) of equal to or less than 90; c) no melting point TmII detectable at the DSC; d) melting enthalpy (ΔHf), measured by…
Operations & Transport · mapped topic
Chemistry & Metallurgy · mapped topic
Mechanical Engineering · mapped topic
Operations & Transport · mapped topic
Operations & Transport · mapped topic
Related publications grouped by family.
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Answers are generated from the same data shown on this page.