Liquid ejection head in which positional relationships of elements are not affected by curing of bonding adhesive

Patent metadata

Field	Value
Publication number	US-9248647-B2
Application number	US-201414326573-A
Country	US
Kind code	B2
Filing date	Jul 9, 2014
Priority date	Jul 24, 2013
Publication date	Feb 2, 2016
Grant date	Feb 2, 2016

Abstract

A liquid ejection head includes an electrical wiring substrate and a printing element substrate, wherein the position variation of the printing element substrate due to curing of a sealing agent is eliminated. Specifically, a gap between two support members is covered with the electrical wiring substrate so as to be able to prevent a sealing agent from flowing into the gap. As a result, even in the case where the size of the gap varies due to the variation in the dimensional accuracy and/or the variation in the assembly accuracy, the sealing agent will not enter this gap, and therefore the shape thereof can be made substantially uniform regardless of the positions. This results in a substantially uniform stress in curing and contracting of the sealing agent, and the variation in the mounting position of the printing element substrate can be suppressed.

First claim

What is claimed is:

1. A liquid ejection head comprising:
a printing element substrate on which an ejection port for ejecting liquid is provided;
a support member supporting the printing element substrate;
another member arranged to be separated from the support member by a gap;
an electrical wiring substrate that is provided to be extended over the support member and the other member and covers the gap; and
an electrical connecting portion having a wiring to electrically connect with the printing element substrate,
wherein the electrical connecting portion is sealed with a sealing agent.

2. The liquid ejection head according to claim 1 , wherein the other member is a frame member having an opening in which the support member is arranged.

3. The liquid ejection head according to claim 2 , wherein the frame member has lower linear expansion coefficient than that of the electrical wiring substrate.

4. The liquid ejection head according to claim 2 , wherein respective surfaces of the support member and the frame member on which the electrical wiring substrate is provided have substantially the same height.

5. The liquid ejection head according to claim 2 , wherein the gap between the support member and the frame member is sealed with a second sealing agent.

6. The liquid ejection head according to claim 1 , wherein the electrical wiring substrate has an opening in which the printing element substrate is arranged and a whole outer periphery of the opening is arranged on the support member.

7. The liquid ejection head according to claim 1 , wherein the electrical wiring substrate has an opening in which the printing element substrate is arranged and only a region of an outer periphery of the opening in which the electrical connecting portion is provided is arranged above the support member.

8. The liquid ejection head according to claim 7 , wherein a dam agent is provided in a boundary between the electrical connecting portion and a non-electrical connecting portion in the outer periphery of the opening of the electrical wiring substrate.

9. The liquid ejection head according to claim 1 , wherein the other member is a support member supporting another printing element substrate and a plate member having an opening in which the printing element substrate is arranged is provided on a part of two support members, the electrical wiring substrate being extended over a space between the two support members.

10. The liquid ejection head according to claim 9 , wherein the plate member has lower linear expansion coefficient than that of the electrical wiring substrate.

11. The liquid ejection head according to claim 9 , wherein respective surfaces of the support member and the plate member on which the electrical wiring substrate is provided have substantially the same height.

12. The liquid ejection head according to claim 1 , wherein a plurality of printing element substrates are provided.

13. The liquid ejection head according to claim 12 , wherein the plurality of printing element substrates is arranged in a staggered form in a predetermined direction.

14. A liquid ejection apparatus that uses a liquid ejection head so as to cause the liquid ejection head to eject liquid, the liquid ejection head comprising:
a printing element substrate on which an ejection port for ejecting liquid is provided;
a support member supporting the printing element substrate;
another member arranged to be separated from the support member by a gap;
an electrical wiring substrate that is provided to be extended over the support member and the other member and covers the gap; and
an electrical connecting portion having a wiring to electrically connect with the printing element substrate,
wherein the electrical connecting portion is sealed with a sealing agent.

Assignees

• Canon Kk

Inventors

• Iwanaga Shuzo
• Tamenaga Zentaro
• Yamada Kazuhiro
• Moriguchi Takuto
• Moriya Takatsugu

Classifications

• B41J2/1623

  bonding and adhesion · CPC title

• B41J2/155

  for line printing · CPC title

• B41J2202/20

  Modules · CPC title

• B41J2202/19

  Assembling head units · CPC title

• B41J2/14024 Primary

  Assembling head parts · CPC title