Modular electronic prototyping platforms
US-12177969-B2 · Dec 24, 2024 · US
US9247635B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9247635-B2 |
| Application number | US-201414317254-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 27, 2014 |
| Priority date | Jun 9, 2014 |
| Publication date | Jan 26, 2016 |
| Grant date | Jan 26, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A flexible substrate includes a base layer, a metallic layer, a solder mask layer and an identifying code, the metallic layer is disposed at a first surface of the base layer, the metallic layer comprises a plurality of traces and at least one bottom block used for defining marked position, wherein the traces and the at least one bottom block are covered with the solder mask layer, wherein above the perpendicular direction of the at least one bottom block of the metallic layer, a pre-marked area is defined on an exposing surface of the solder mask layer and by an outlined edge of the at least one bottom block, and the identifying code is formed within the pre-marked area of the solder mask layer.
Opening claim text (preview).
What is claimed is: 1. A flexible substrate includes: a base layer having a first surface and a second surface opposite to the first surface; a metallic layer formed on the first surface of the base layer, the metallic layer comprises a plurality of traces and at least one bottom block for defining marked position; a solder mask layer, wherein the solder mask layer is a material that is pervious to light and comprises an exposing surface, the traces and the at least one bottom block are covered with the solder mask layer, wherein a pre-marked area is defined on the exposing surface of the solder mask layer and by an outlined edge of the at least one bottom block, the pre-marked area is located above the perpendicular direction of the at least one bottom block of the metallic layer, and the range of the pre-marked area is defined by projection of the outlined edge of the at least one bottom block; and an identifying code formed within the pre-marked area of the solder mask layer, wherein the at least one bottom block comprises a first longitudinal edge, a lateral edge and an initial identifying portion, wherein a first extension line of the first longitudinal edge intersects with a second extension line of the lateral edge, and the initial identifying portion is located at the intersection position of the first extension line and the second extension line. 2. The flexible substrate in accordance with claim 1 , wherein the shape of the pre-marked area is the same with the shape of the at least one bottom block. 3. The flexible substrate in accordance with claim 1 , wherein the identifying code is a character string including a first character and at least one second character, wherein a first horizontal distance is defined between the first character and the initial identifying portion, a second horizontal distance is defined between the at least one second character and the initial identifying portion, and the first horizontal distance is smaller than the second horizontal distance. 4. The flexible substrate in accordance with claim 3 further includes a plurality of transmission holes communicating with the first surface and the second surface of the base layer, wherein the transmission holes are arranged in order and disposed at two sides of the base layer, each of the transmission holes comprises a first area, the at least one bottom block comprises a second area larger than the first area. 5. The flexible substrate in accordance with claim 4 , wherein the arrangement direction of the transmission holes is the transmission direction of the flexible substrate, the at least one bottom block comprises a first longitudinal edge along with the arrangement direction of the transmission holes, each of the transmission holes comprises a second longitudinal edge along with the arrangement direction of the transmission holes, the first longitudinal edge is larger than the second longitudinal edge. 6. The flexible substrate in accordance with claim 4 , wherein the arrangement direction of the transmission holes is the transmission direction of the flexible substrate, each of the transmission holes comprises a second longitudinal edge along with the arrangement direction of the transmission holes, the at least one bottom block comprises a lateral edge along with the direction perpendicular to the arrangement direction of the transmission holes, the lateral edge is larger than the second longitudinal edge. 7. The flexible substrate in accordance with claim 1 further includes a plurality of transmission holes communicating with the first surface and the second surface of the base layer, wherein the transmission holes are arranged in order and disposed at two sides of the base layer, each of the transmission holes comprises a first area, the at least one bottom block comprises a second area larger than the first area. 8. The flexible substrate in accordance with claim 7 , wherein the arrangement direction of the transmission holes is the transmission direction of the flexible substrate, the at least one bottom block comprises a first longitudinal edge along with the arrangement direction of the transmission holes, each of the transmission holes comprises a second longitudinal edge along with the arrangement direction of the transmission holes, the first longitudinal edge is larger than the second longitudinal edge. 9. The flexible substrate in accordance with claim 7 , wherein the arrangement direction of the transmission holes is the transmission direction of the flexible substrate, each of the transmission holes comprises a second longitudinal edge along with the arrangement direction of the transmission holes, the at least one bottom block comprises a lateral edge along with the direction perpendicular to the arrangement direction of the transmission holes, the lateral edge is larger than the second longitudinal edge.
Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title
Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title
Multilayer circuits · CPC title
for visual or optical inspection · CPC title
Coating free areas, e.g. areas other than pads or lands free of solder resist · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.