Flexible substrate

US9247635B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9247635-B2
Application numberUS-201414317254-A
CountryUS
Kind codeB2
Filing dateJun 27, 2014
Priority dateJun 9, 2014
Publication dateJan 26, 2016
Grant dateJan 26, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A flexible substrate includes a base layer, a metallic layer, a solder mask layer and an identifying code, the metallic layer is disposed at a first surface of the base layer, the metallic layer comprises a plurality of traces and at least one bottom block used for defining marked position, wherein the traces and the at least one bottom block are covered with the solder mask layer, wherein above the perpendicular direction of the at least one bottom block of the metallic layer, a pre-marked area is defined on an exposing surface of the solder mask layer and by an outlined edge of the at least one bottom block, and the identifying code is formed within the pre-marked area of the solder mask layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A flexible substrate includes: a base layer having a first surface and a second surface opposite to the first surface; a metallic layer formed on the first surface of the base layer, the metallic layer comprises a plurality of traces and at least one bottom block for defining marked position; a solder mask layer, wherein the solder mask layer is a material that is pervious to light and comprises an exposing surface, the traces and the at least one bottom block are covered with the solder mask layer, wherein a pre-marked area is defined on the exposing surface of the solder mask layer and by an outlined edge of the at least one bottom block, the pre-marked area is located above the perpendicular direction of the at least one bottom block of the metallic layer, and the range of the pre-marked area is defined by projection of the outlined edge of the at least one bottom block; and an identifying code formed within the pre-marked area of the solder mask layer, wherein the at least one bottom block comprises a first longitudinal edge, a lateral edge and an initial identifying portion, wherein a first extension line of the first longitudinal edge intersects with a second extension line of the lateral edge, and the initial identifying portion is located at the intersection position of the first extension line and the second extension line. 2. The flexible substrate in accordance with claim 1 , wherein the shape of the pre-marked area is the same with the shape of the at least one bottom block. 3. The flexible substrate in accordance with claim 1 , wherein the identifying code is a character string including a first character and at least one second character, wherein a first horizontal distance is defined between the first character and the initial identifying portion, a second horizontal distance is defined between the at least one second character and the initial identifying portion, and the first horizontal distance is smaller than the second horizontal distance. 4. The flexible substrate in accordance with claim 3 further includes a plurality of transmission holes communicating with the first surface and the second surface of the base layer, wherein the transmission holes are arranged in order and disposed at two sides of the base layer, each of the transmission holes comprises a first area, the at least one bottom block comprises a second area larger than the first area. 5. The flexible substrate in accordance with claim 4 , wherein the arrangement direction of the transmission holes is the transmission direction of the flexible substrate, the at least one bottom block comprises a first longitudinal edge along with the arrangement direction of the transmission holes, each of the transmission holes comprises a second longitudinal edge along with the arrangement direction of the transmission holes, the first longitudinal edge is larger than the second longitudinal edge. 6. The flexible substrate in accordance with claim 4 , wherein the arrangement direction of the transmission holes is the transmission direction of the flexible substrate, each of the transmission holes comprises a second longitudinal edge along with the arrangement direction of the transmission holes, the at least one bottom block comprises a lateral edge along with the direction perpendicular to the arrangement direction of the transmission holes, the lateral edge is larger than the second longitudinal edge. 7. The flexible substrate in accordance with claim 1 further includes a plurality of transmission holes communicating with the first surface and the second surface of the base layer, wherein the transmission holes are arranged in order and disposed at two sides of the base layer, each of the transmission holes comprises a first area, the at least one bottom block comprises a second area larger than the first area. 8. The flexible substrate in accordance with claim 7 , wherein the arrangement direction of the transmission holes is the transmission direction of the flexible substrate, the at least one bottom block comprises a first longitudinal edge along with the arrangement direction of the transmission holes, each of the transmission holes comprises a second longitudinal edge along with the arrangement direction of the transmission holes, the first longitudinal edge is larger than the second longitudinal edge. 9. The flexible substrate in accordance with claim 7 , wherein the arrangement direction of the transmission holes is the transmission direction of the flexible substrate, each of the transmission holes comprises a second longitudinal edge along with the arrangement direction of the transmission holes, the at least one bottom block comprises a lateral edge along with the direction perpendicular to the arrangement direction of the transmission holes, the lateral edge is larger than the second longitudinal edge.

Assignees

Inventors

Classifications

  • Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title

  • Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

  • Multilayer circuits · CPC title

  • H05K1/0269Primary

    for visual or optical inspection · CPC title

  • Coating free areas, e.g. areas other than pads or lands free of solder resist · CPC title

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Frequently asked questions

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What does patent US9247635B2 cover?
A flexible substrate includes a base layer, a metallic layer, a solder mask layer and an identifying code, the metallic layer is disposed at a first surface of the base layer, the metallic layer comprises a plurality of traces and at least one bottom block used for defining marked position, wherein the traces and the at least one bottom block are covered with the solder mask layer, wherein abov…
Who is the assignee on this patent?
Chipbond Technology Corp
What technology area does this patent fall under?
Primary CPC classification H05K1/0269. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 26 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).