Electrically isolated, high melting point, metal wire arrays and method of making same

Patent metadata

Field	Value
Publication number	US-9245671-B2
Application number	US-201213420205-A
Country	US
Kind code	B2
Filing date	Mar 14, 2012
Priority date	Mar 14, 2012
Publication date	Jan 26, 2016
Grant date	Jan 26, 2016

Abstract

A method of making a wire array includes the step of providing a tube of a sealing material and having an interior surface, and positioning a wire in the tube, the wire having an exterior surface. The tube is heated to soften the tube, and the softened tube is drawn and collapsed by a mild vacuum to bring the interior surface of the tube into contact with the wire to create a coated wire. The coated wires are bundled. The bundled coated wires are heated under vacuum to fuse the tube material coating the wires and create a fused rod with a wire array embedded therein. The fused rod is cut to form a wire array. A wire array is also disclosed.

First claim

We claim:

1. A method of making a wire array device, comprising steps of:
providing a tube of a sealing material, the tube having an interior surface;
positioning a wire in the tube, the wire having an exterior surface, wherein the wire material has a melting point higher than the melting point of the sealing material and an outside diameter of the wire is less than an inside diameter of the tube, wherein voids are present between the wire and the tube;
heating and softening the tube and drawing the softened tube to bring the interior surface of the tube into contact with the exterior surface of the wire to create a coated wire;
bundling the coated wire to form a plurality of bundled individually coated wires comprising voids between the coated wire;
heating the plurality of bundled individually coated wires to fuse the sealing material coating the coated wire to create a solid fused rod with an array of the wire embedded within a solid matrix of sealing material, with the sealing material separating the wire from contact with each other;
wherein voids between the tube and the wire and voids between the bundled coated wire are removed; and,
further comprising a step of cutting the fused rod into wafers, to make the wire array device.

2. The method of claim 1 , wherein prior to the drawing step the tube is heated and drawn to form a pre-form tube having an inside diameter less than the inside diameter of the tube.

3. The method of claim 1 , wherein the drawing step comprises first engaging and pulling the wire, and subsequently engaging and pulling the coated wire.

4. The method of claim 1 , further comprising the step of removing end portions of the sealing material to expose end portions of the wires.

5. The method of claim 4 , wherein portions of the exposed wires are removed to form a pointed end.

6. The method of claim 4 , wherein said removal step is by etching.

7. A method of making a wire array device, comprising steps of:
providing a tube of a sealing material, the tube having an interior surface;
positioning a wire in the tube, the wire having an exterior surface, wherein the wire has a melting point higher than a melting point of the sealing material;
heating and softening the tube and drawing the softened tube to bring the interior surface of the tube into contact with the exterior surface of the wire to create a coated wire;
bundling a plurality of the coated wire to form bundled coated wires comprising voids between the coated wires;
heating the bundled coated wires to fuse the sealing material coating the wire and remove the voids between the coated wire to create a solid fused rod with an array of the wire embedded therein;
further comprising a step of removing end portions of the sealing material to expose end portions of the wires, wherein portions of the exposed wires are removed to form a pointed end, and wherein the pointed wires are bent such that an axis of the pointed end is at least 30 degrees from the axis of the wire, to make the wire array device.

8. The method of claim 1 , wherein the parameters of the draw are selected such that in the absence of the metal wire the inside diameter of the drawn tube would be similar to or smaller than the diameter of the wire.

9. The method of claim 1 , wherein the diameter of the wire is between 1 and 200 μM.

10. The method of claim 1 wherein the sealing material is selected to wet the wire.

11. A method of making a wire array device, comprising the steps of:
providing a tube of a sealing material, the tube having an interior surface;
positioning a wire in the tube, the wire having an exterior surface, wherein the wire has a melting point higher than the melting point of the sealing material;
heating and softening the tube and drawing the softened tube to bring the interior surface of the tube into contact with the exterior surface of the wire to create a coated wire;
bundling a plurality of the coated wires to form bundled coated wires comprising voids between coated wire;
heating the bundled coated wires to fuse the sealing material coating the wire and remove the voids between coated wire to create a solid fused rod with an array of the wire embedded therein;
wherein a coefficient of thermal expansion (CTE) difference between the sealing material and the wire is ΔCTE<1-5×10-7/° C., to make the wire array device.

12. The method of claim 1 , wherein the tube is heated to a temperature that is less than the melting point of the wire (Tm), but above the glass transition temperature of the glass (Tg).

13. The method of claim 1 , wherein the sealing material is glass.

14. The method of claim 13 , wherein the glass is at least one selected from the group consisting of Corning Pyrex, Schott 8330, Schott Fiolax, Schott 8487, or soda lime glass.

15. The method of claim 1 , wherein the wire comprises at least one selected from the group consisting of platinum, iridium, platinum-iridium alloy, stainless steel, tungsten, and mixtures or alloys thereof.

16. The method of claim 1 , wherein a vacuum is applied to the tube during the drawing step.

17. The method of claim 1 , wherein tubes filled with a material other than the wire material are bundled with the coated wires prior to the fusing step.

18. The method of claim 1 , wherein hollow tubes are bundled with the coated wires prior to the fusing step.

19. The method of claim 1 , wherein solid rods of the sealing material are bundled with the coated wires prior to the fusing step.

Assignees

• Simpson John T
• Cunningham Joseph P
• D Urso Brian R
• Hendricks Troy R
• Schaeffer Daniel A
• Ut Battelle Llc

Inventors

• Simpson John T
• Cunningham Joseph P
• D Urso Brian R
• Hendricks Troy R
• Schaeffer Daniel A

Classifications

• Y10T156/1084

  of continuous or running length bonded web · CPC title

• Y10T156/1002

  with permanent bending or reshaping or surface deformation of self sustaining lamina · CPC title

• H01B13/14 Primary

  by extrusion {(extrusion in general B29C48/00)} · CPC title