Systems, compositions, and methods for enhanced electromagnetic shielding and corrosion resistance
US-11965116-B2 · Apr 23, 2024 · US
US9245665B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9245665-B2 |
| Application number | US-201314105359-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 13, 2013 |
| Priority date | Dec 14, 2012 |
| Publication date | Jan 26, 2016 |
| Grant date | Jan 26, 2016 |
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A conductive metal composition comprising 40 to 88 wt % of silver particles having an average particle size in the range of 10 to 100 nm and having an aspect ratio of 3 to 1:1, 2 to 20 wt % of a poly(2-ethyl-2-oxazoline) resin having a weight-average molar mass of 50,000 to 500,000 and 10 to 58 wt % of a solvent for the poly(2-ethyl-2-oxazoline) resin.
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What is claimed is: 1. An electrically conductive metal composition comprising 40 to 88 wt % of the total composition of silver particles having an average particle size in the range of 10 to 100 nm and having an aspect ratio of 3 to 1:1, 2 to 20 wt % of the total composition of a poly(2-ethyl-2-oxazoline) resin having a weight-average molar mass of 50,000 to 500,000 and 10 to 58 wt % of the total composition of a solvent for the poly(2-ethyl-2-oxazoline) resin. 2. The conductive metal composition of claim 1 , wherein the silver particles are 65 to 80 wt % of the total composition. 3. The conductive metal composition of claim 1 , wherein the poly(2-ethyl-2-oxazoline) resin is 5 to 15 wt % of the total composition. 4. The conductive metal composition of claim 1 , wherein the poly(2-ethyl-2-oxazoline) resin has a weight-average molar mass of 50,000 to 200,000. 5. The conductive metal composition of claim 1 , wherein the solvent is 10 to 40 wt % of the total composition. 6. The conductive metal composition of claim 1 , wherein the solvent is selected from the group consisting of water, a mixture of water and one or more organic solvents, a single organic solvent and a mixture of two or more organic solvents. 7. The conductive metal composition of claim 1 comprising one or more additives. 8. The conductive metal composition of claim 1 consisting of 40 to 88 wt % of the total composition of silver particles having an average particle size in the range of 10 to 100 nm and having an aspect ratio of 3 to 1:1, 2 to 20 wt % of the total composition of a poly(2-ethyl-2-oxazoline) resin having a weight-average molar mass of 50.000 to 500.000, 10 to 58 wt % of the total composition of a solvent for the poly(2-ethyl-2-oxazoline) resin, and 0 to 2 wt % of the total composition of at least one additive, wherein the sum of the wt % totals 100 wt %. 9. A process for the production of a conductive metallization on a substrate comprising the steps: (1) providing a substrate, (2) applying a conductive metal composition of claim 1 on the substrate, and (3) subjecting the conductive metal composition applied in step (2) to photonic sintering to form a conductive metallization on the substrate. 10. The process of claim 9 , wherein the substrate comprises one or more than one material. 11. The process of claim 9 , wherein the substrate is a temperature-sensitive substrate. 12. The process of claim 9 , wherein the conductive metal composition is applied by printing or pen-writing. 13. The process of claims 9 , wherein the applied conductive metal composition is dried prior to performing step (3). 14. The process of claim 9 , wherein step (3) is performed within ≦1 second.
using irradiation · CPC title
Metals · CPC title
to obtain a coating with specific electrical properties · CPC title
the conductive material comprising metals or alloys · CPC title
Additives defined by their aspect ratio · CPC title
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