Conductive metal ink

Patent metadata

Field	Value
Publication number	US-9245664-B2
Application number	US-201213463927-A
Country	US
Kind code	B2
Filing date	May 4, 2012
Priority date	Dec 2, 2011
Publication date	Jan 26, 2016
Grant date	Jan 26, 2016

Abstract

A conductive metal composition comprising 50 to 94 wt % of silver particles having an average particle size in the range of 40 to 450 nm and having an aspect ratio of 3 to 1:1, 1 to 4 wt % of a thermoplastic polyester resin having a weight-average molar mass of 10000 to 150000, and 4 to 49 wt % of a diluent for the thermoplastic polyester resin.

First claim

What is claimed is:

1. A conductive metal composition comprising a conductive component consisting of 50 to 94 wt % of silver particles having an average particle size in the range of 40 to less than 450 nm and having an aspect ratio of 3 to 1:1, 1 to 4 wt % of a thermoplastic polyester resin having a weight-average molar mass of 10000 to 150000, and 4 to 49 wt % of a diluent for the thermoplastic polyester resin.

2. The conductive metal composition of claim 1 , wherein the silver particles are 60 to 90 wt % of the composition.

3. The conductive metal composition of claim 1 , wherein the thermoplastic polyester resin is 2 to 3.5 wt % of the composition.

4. The conductive metal composition of claim 1 , wherein the diluent is 7 to 38 wt % of the composition.

5. The conductive metal composition of claim comprising one or more additives.

6. The conductive metal composition of claim 1 consisting of 50 to 94 wt % of silver particles having an average particle size in the range of 40 to less than 450 nm and having an aspect ratio of 3 to 1:1, 1 to 4 wt % of a thermoplastic polyester resin having a weight-average molar mass of 10000 to 150000, 4 to 49 wt % of a diluent for the thermoplastic polyester resin, and 0 to <1 wt % of at least one additive, wherein the sum of the wt % totals 100 wt %.

7. The conductive metal composition of claim 1 , wherein the thermoplastic polyester resin is a linear polyester resin.

8. A process for the production of a conductive metallization on a substrate, comprising the steps:
(1) providing a substrate,
(2) applying the conductive metal composition of claim 1 on the substrate, and
(3) drying the applied conductive metal composition to form a conductive metallization on the substrate.

9. The process of claim 8 , wherein the substrate comprises one or more materials.

10. The process of claim 9 , wherein the substrate comprises two or more materials, wherein one or more of the materials is selected from the group consisting of: dielectric layers and active layers.

11. The process of claim 10 , wherein the active layers is selected from the group consisting of: photoactive layer, light-emissive layer, semiconductive layer and non-metallic conductive layer.

12. The process of claim 9 , wherein the one or one or more of the more than one materials is a bulk material selected from the group consisting of: organic polymers, inorganic non-metallic materials and metals.

13. The process of claim 8 , wherein the conductive metal composition is applied by printing or pen-writing.

14. The process of claim 8 , wherein the drying is performed for a period of 1 to 60 minutes at an object temperature in the range of 100 to 240° C.

15. The process of claim 8 , wherein the drying is performed by photonic heating, microwave heating or inductive heating.

Assignees

• Kirk Daniel
• Hui Dave
• Sweet Martin
• Du Pont

Inventors

• Kirk Daniel
• Hui Dave
• Sweet Martin

Classifications

• C08K2201/016

  Additives defined by their aspect ratio · CPC title

• H05K3/1283

  After-treatment of the printed patterns, e.g. sintering or curing methods · CPC title

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title

• H05K1/097

  Inks comprising nanoparticles and specially adapted for being sintered at low temperature (H05K1/095 takes precedence) · CPC title

• C09D5/24

  Electrically-conducting paints {(conductive materials H01B1/00)} · CPC title