Microlithographic projection exposure apparatus illumination optics
US-9223226-B2 · Dec 29, 2015 · US
Exposure apparatus, exposure method, and device manufacturing method
US9244367B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9244367-B2 |
| Application number | US-201514661903-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 18, 2015 |
| Priority date | Aug 25, 2009 |
| Publication date | Jan 26, 2016 |
| Grant date | Jan 26, 2016 |
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Abstract
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An exposure apparatus is equipped with an encoder system which measures positional information of a wafer stage by irradiating a measurement beam using four heads installed on the wafer stage on a scale plate which covers the movement range of the wafer stage except for the area right under a projection optical system. Placement distances of the heads here are each set to be larger than width of the opening of the scale plates, respectively. This allows the positional information of the wafer stage to be measured, by switching and using the three heads facing the scale plate out of the four heads according to the position of the wafer stage.
First claim
Opening claim text (preview).
What is claimed is: 1. An exposure apparatus that exposes a substrate with illumination light via a projection optical system, the apparatus comprising: a stage having a holder to hold the substrate; a drive system having a planar motor, that drives the stage so that the substrate is moved in directions of six degrees of freedom including a first direction and a second direction orthogonal to each other within a predetermined plane perpendicular to an optical axis of the project…
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- G03F7/70108Primary
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
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- What does patent US9244367B2 cover?
- An exposure apparatus is equipped with an encoder system which measures positional information of a wafer stage by irradiating a measurement beam using four heads installed on the wafer stage on a scale plate which covers the movement range of the wafer stage except for the area right under a projection optical system. Placement distances of the heads here are each set to be larger than width o…
- Who is the assignee on this patent?
- Nikon Corp
- What technology area does this patent fall under?
- Primary CPC classification G03F7/70108. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Jan 26 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).