Method for measuring pattern misalignment

Patent metadata

Field	Value
Publication number	US-9244365-B2
Application number	US-201313952943-A
Country	US
Kind code	B2
Filing date	Jul 29, 2013
Priority date	Mar 22, 2013
Publication date	Jan 26, 2016
Grant date	Jan 26, 2016

Abstract

According to one embodiment, a method for measuring pattern misalignment, includes: a first step obtaining image data; a second step specifying a measurement region; a third step calculating a first shift amount (x 1 , y 1 ); a fourth step determining, after calculating the first shift amount, a first distribution; a fifth step executing a plurality of times the second step, the third step, and the fourth step; a seventh step calculating a second shift amount (x 2 , y 2 ); an eighth step determining, after calculating the second shift amount, a second distribution; a ninth step executing a plurality of times the sixth step, the seventh step, and the eighth step; and a tenth step calculating a difference (x 2 −x 1 , y 2 −y 1 ) between the second pattern misalignment and the first pattern misalignment.

First claim

What is claimed is:

1. A method for measuring pattern misalignment, comprising:
a first step obtaining image data of a surface image of a to-be-measured substrate including on its surface a first layer having a first pattern and a second layer provided on the first layer and having a second pattern from the surface side of the substrate, the surface image including an image of the first pattern and an image of the second pattern, and the image data being represented by an X-Y coordinate system;
a second step specifying a measurement region in the image data and to specify a first reference region corresponding to the measurement region in design data of the first pattern represented by the X-Y coordinate system;
a third step calculating a first shift amount (x 1 , y 1 ) of the first reference region in the X-Y coordinate system using a pattern matching technique when a portion of the design data of the first pattern in the first reference region is best matched with a portion of the image data corresponding to the image of the first pattern in the measurement region;
a fourth step determining, after calculating the first shift amount, a first distribution of spacing between a first contour and a first design contour and to calculate a first standard deviation of the first distribution, the first contour defining the portion of the image data corresponding to the image of the first pattern in the measurement region, and the first design contour defining the portion of the design data of the first pattern in the first reference region;
a fifth step executing a plurality of times the second step, the third step, and the fourth step while expanding the measurement region of the second step, and then when it is determined that the first standard deviation for last execution is stabilized, to take the first shift amount (x 1 , y 1 ) for the last execution as a first pattern misalignment;
a sixth step specifying a measurement region in the image data and to specify a second reference region corresponding to the measurement region in design data of the second pattern represented by the X-Y coordinate system;
a seventh step calculating a second shift amount (x 2 , y 2 ) of the second reference region in the X-Y coordinate system using a pattern matching technique when a portion of the design data of the second pattern in the second reference region is best matched with a portion of the image data corresponding to the image of the second pattern in the measurement region;
an eighth step determining, after calculating the second shift amount, a second distribution of spacing between a second contour and a second design contour and to calculate a second standard deviation of the second distribution, the second contour defining the portion of the image data corresponding to the image of the second pattern in the measurement region, and the second design contour defining the portion of the design data of the second pattern in the second reference region;
a ninth step executing a plurality of times the sixth step, the seventh step, and the eighth step while expanding the measurement region of the sixth step, and then when it is determined that a value of the second standard deviation for last execution is stabilized, to take the second shift amount for the last execution as a second pattern misalignment (x 2 , y 2 ); and
a tenth step calculating a difference (x 2 −x 1 , y 2 −y 1 ) between the second pattern misalignment and the first pattern misalignment as a misalignment of the second pattern with respect to the first pattern.

2. The method according to claim 1 , wherein the image data is a secondary electron image based on a scanning electron microscope.

3. The method according to claim 1 , wherein
when a difference between a value of the first standard deviation for the last execution and an average value of the first standard deviations for the executions of a plurality of most recent times in the fifth step becomes a prescribed value or less, it is determined that the value of the first standard deviation for the last execution is stabilized, and
when a difference between a value of the second standard deviation for the last execution and an average value of the second standard deviations for the executions of a plurality of most recent times in the ninth step becomes a prescribed value or less, it is determined that the value of the second standard deviation for the last execution is stabilized.

4. The method according to claim 1 , wherein
the image data is a secondary electron image based on a scanning electron microscope,
when a difference between a value of the first standard deviation for the last execution and an average value of the first standard deviations for the executions of a plurality of most recent times in the fifth step becomes a prescribed value or less, it is determined that the value of the first standard deviation for the last execution is stabilized, and
when a difference between a value of the second standard deviation for the last execution and an average value of the second standard deviations for the executions of a plurality of most recent times in the ninth step becomes a prescribed value or less, it is determined that the value of the second standard deviation for the last execution is stabilized.

5. The method according to claim 1 , wherein
when the first distribution is determined in the fourth step, the spacing between the first contour and the first design contour is length of a normal extending from one point on the first design contour to the first contour, and
when the second distribution is determined in the eighth step, the spacing between the second contour and the second design contour is length of a normal extending from one point on the second design contour to the second contour.

6. The method according to claim 1 , wherein
the image data is a secondary electron image based on a scanning electron microscope,
when the first distribution is determined in the fourth step, the spacing between the first contour and the first design contour is length of a normal extending from one point on the first design contour to the first contour, and
when the second distribution is determined in the eighth step, the spacing between the second contour and the second design contour is length of a normal extending from one point on the second design contour to the second contour.

7. The method according to claim 1 , wherein
when a difference between a value of the first standard deviation for the last execution and an average value of the first standard deviations for the executions of a plurality of most recent times in the fifth step becomes a prescribed value or less, it is determined that the value of the first standard deviation for the last execution is stabilized,
when a difference between a value of the second standard deviation for the last execution and an average value of the second standard deviations for the executions of a plurality of most recent times in the ninth step becomes a prescribed value or less, it is determined that the value of the second standard deviation for the last execution is stabilized,
when the first distribution is determined in the fourth step, the spacing between the first contour and the first design contour is length of a normal extending from one point on the first design contour to the first contour, and
when the second distribution is determined in the eighth step, the spacing between the second contour and the second design contour is length of a normal extending from one point on the second design contour to the second contour.

8. The method according to claim 1 , wherein the pattern matching technique in the third step and the seventh step is a template matching technique.

Assignees

• Toshiba Kk

Inventors

• Okamoto Yosuke
• Hagio Yoshinori

Classifications

• G03F7/70633 Primary

  Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching · CPC title

• G06T2207/30148

  Semiconductor; IC; Wafer · CPC title

• G06T7/0004

  Industrial image inspection · CPC title

• G06T2207/10061

  from scanning electron microscope · CPC title