Surface treatment liquid, surface treatment method, hydrophobilization method, and hydrophobilized substrate

Patent metadata

Field	Value
Publication number	US-9244358-B2
Application number	US-200913123341-A
Country	US
Kind code	B2
Filing date	Sep 15, 2009
Priority date	Oct 21, 2008
Publication date	Jan 26, 2016
Grant date	Jan 26, 2016

Abstract

Disclosed is a surface treatment liquid which enables simple and efficient hydrophobilization of a substrate and prevention of collapse of a resin pattern or etched pattern. Also disclosed are a surface treatment method using the surface treatment liquid, a hydrophobilization method using the surface treatment liquid, and a hydrophobilized substrate. When a substrate is hydrophobilized, the substrate is coated with a surface treatment liquid containing a silylating agent and a hydrocarbon non-polar solvent. When a pattern is prevented from collapse, the surface of a resin pattern formed on a substrate or etched pattern formed on a substrate by etching is treated using a surface treatment liquid containing a silylating agent and a solvent.

First claim

The invention claimed is:

1. A surface treatment liquid comprising at least one silylating agent selected from the group consisting of N,N-dimethylaminotrimethylsilane (DMATMS), hexamethyldisilazane (HMDS) and trimethylsilyloxy-3-penten-2-one (TMSP), and at least one nonpolar solvent selected from the group consisting of n-nonane, methyloctane, n-decane, n-undecane, n-dodecane, menthane and pinane, wherein the surface treatment liquid is in liquid form when applied to a substrate.

2. The surface treatment liquid according to claim 1 , wherein the content of the silylating agent is 0.1 to 50% by mass.

3. The surface treatment liquid according claim 1 , wherein the silylating agent is N,N-dimethylaminotrimethylsilane (DMATMS).

4. A hydrophobilization method comprising applying on a substrate the surface treatment liquid according to claim 1 to permit hydrophobilization.

5. The hydrophobilization method according to claim 4 , wherein the surface treatment liquid is applied only onto an outer edge of the substrate.

6. A surface treatment method comprising:
subjecting a surface of a resin pattern provided on a substrate, or an etched pattern formed on a substrate by etching, to a treatment with the surface treatment liquid according to claim 1 ; and
washing the resin pattern or the etched pattern treated with the surface treatment liquid.

7. The surface treatment method according to claim 6 , wherein the content of the silylating agent in the surface treatment liquid is 0.1 to 50% by mass.

8. The surface treatment method according to claim 6 , wherein the silylating agent is N,N-dimethylaminotrimethylsilane (DMATMS).

Assignees

• Koshiyama Jun
• Wakiya Kazumasa
• Tokyo Ohka Kogyo Co Ltd

Inventors

• Koshiyama Jun
• Wakiya Kazumasa

Classifications

• H10P50/00 Primary

  Etching of wafers, substrates or parts of devices · CPC title

• H10W74/476

  Organic materials comprising silicon · CPC title

• G03F7/2041

  in the presence of a fluid, e.g. immersion; using fluid cooling means · CPC title

• G03F7/16

  Coating processes; Apparatus therefor (applying coatings to base materials in general B05; applying photosensitive compositions to base for photographic purposes G03C1/74) · CPC title

• H01L21/306

  Electricity · mapped topic