Curable composition

Patent metadata

Field	Value
Publication number	US-9243143-B2
Application number	US-201414459184-A
Country	US
Kind code	B2
Filing date	Aug 13, 2014
Priority date	Apr 4, 2013
Publication date	Jan 26, 2016
Grant date	Jan 26, 2016

Abstract

Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ability, and crack resistance, even when a semiconductor device to which the composition is applied is used at a high temperature for a long time, performance of the device may be stably maintained. Specifically the curable composition is a blend of three different polyorganosiloxanes having aliphatic unsaturated groups and specific Ar/Si ratios and a polyorganosiloxane having SiH groups.

First claim

What is claimed is:

1. A curable composition, comprising:
(A) a linear or partially-crosslinked polyorganosiloxane having an aliphatic unsaturated bond;
(B) a mixture of a first crosslinked polyorganosiloxane having an aliphatic unsaturated bond and a molar ratio (Ar/Si) of aryl (Ar) groups to total silicon (Si) atoms of 0.3 or less and having an average empirical formula of Formula 1, and a second crosslinked polyorganosiloxane having an aliphatic unsaturated bond and a molar ratio (Ar/Si) of aryl (Ar) groups to total silicon (Si) atoms of 0.3 or more, which is different from that of the first crosslinked polyorganosiloxane; and
(C) a polyorganosiloxane including a hydrogen atom and an aryl group, which bind to a silicon atom, having a molar ratio of aryl (Ar) groups to silicon (Si) atoms of 0.3 or more, and including 3 to 10 silicon atoms:
(R 1 3 SiO 1/2 ) a (R 2 2 SiO 2/2 ) b (R 3 SiO 3/2 ) c (SiO 4/2 ) d (OR) e   [Formula 1]

where R 1 to R 3 are each independently an alkyl group, an alkenyl group, an alkynyl group or an aryl group, at least one of R 1 to R 3 is an alkenyl group, R is hydrogen, an alkyl group, an alkenyl group or an alkynyl group, a, b, c and e are each independently 0 or a positive number, d is a positive number, d/(c+d) is 0.3 or more, and e/(c+d) is 0.2 or less.

2. The curable composition according to claim 1 , wherein the second crosslinked polyorganosiloxane has an average empirical formula of Formula 2:
(R 4 3 SiO 1/2 ) f (R 5 2 SiO 2/2 ) g (R 6 SiO 3/2 ) h (SiO 4/2 ) i (OR) j   [Formula 2]

where R, R 4 , and R 5 are each independently an epoxy group or a monovalent hydrocarbon group, at least one of R 4 and R 5 is an alkenyl group, at least one of R 4 and R 5 is an aryl group, R is hydrogen or a monovalent hydrocarbon group, f, g, and i are each independently 0 or a positive number, h is a positive number, h/(h+i) is 0.7 or more, and j/(h+i) is 0.2 or less.

3. The curable composition according to claim 1 , wherein the second crosslinked polyorganosiloxane is included at 5 to 100 parts by weight with respect to 100 parts by weight of the first crosslinked polyorganosiloxane.

4. The curable composition according to claim 1 , wherein a ratio (H/Si) of a number of moles of hydrogen (H) atoms to a number of moles of total silicon (Si) atoms of the polyorganosiloxane (C) is 0.2 to 0.8.

5. The curable composition according to claim 1 , wherein the polyorganosiloxane (C) has a viscosity at 25° C. of 300 mPa·s or less.

6. The curable composition according to claim 1 , wherein the polyorganosiloxane (C) has a molecular weight of less than 1,000.

7. The curable composition according to claim 1 , wherein the polyorganosiloxane (C) is a compound of Formula 3 or 4:

where R, R 1 , and R 2 are each independently hydrogen, an epoxy group, or a monovalent hydrocarbon group, at least one R is an aryl group, at least one of R 1 and R 2 is an aryl group, and n is a number from 1 to 10.

8. The curable composition according to claim 1 , wherein the polyorganosiloxane (C) is included in such a range that a molar ratio (H/Ak) of hydrogen (H) atoms binding to a silicon atom to total alkenyl (Ak) groups included in the curable composition is 0.5 to 3.0.

9. The curable composition according to claim 1 , further comprising a polyorganosiloxane including a hydrogen atom binding to a silicon atom, having a molar ratio of aryl (Ar) groups to silicon (Si) atoms of 0.3 or less, and including 10 to 50 silicon atoms.

10. The curable composition according to claim 1 , further comprising a compound of an average empirical formula of Formula 5:
(HR 2 SiO 1/2 ) a (RSiO 3/2 ) b (R 2 SiO 2/2 ) c   [Formula 5]

where each R is independently a monovalent hydrocarbon group, at least one R is an aryl group, and when the sum (a+b+c) of a, b, and c is 1, a is 0.3 to 0.8, b is 0.2 to 0.7, and c is 0 to 0.5.

11. The curable composition according to claim 1 , further comprising a compound of Formula 6:
R 3 SiO(HRSiO) r (R 2 SiO) s OSiR 3   [Formula 6]

where each R is independently hydrogen, an epoxy group, or a monovalent hydrocarbon group, r is a number from 5 to 100, and s is a number from 0 to 100.

12. The curable composition according to claim 1 , wherein the linear or partially-crosslinked polyorganosiloxane has a molar ratio (Ar/Si) of aryl (Ar) groups to total silicon (Si) atoms of 0.2 or less.

13. The curable composition according to claim 1 , wherein the linear or partially-crosslinked polyorganosiloxane has a molar ratio (Ar/Si) of aryl (Ar) groups to total silicon (Si) atoms of 0.3 or more.

14. The curable composition according to claim 1 , further comprising
a polyorganosiloxane including an alkenyl group and an epoxy group, which bind to a silicon atom, and having a molar ratio (Ak/Si) of alkenyl (Ak) groups to total silicon (Si) atoms of 0.02 to 0.5, a molar ratio (Ar/Si) of aryl (Ar) groups to total silicon (Si) atoms of 0.9 or less, and a molar ratio (Ep/Si) of epoxy (Ep) groups to total silicon (Si) atoms of 0.01 to 0.5.

15. A semiconductor device encapsulated with an encapsulant including a cured product of the curable composition of claim 1 .

16. An optical semiconductor device encapsulated with an encapsulant including a cured product of the curable composition of claim 1 .

17. A liquid crystal display device comprising the optical semiconductor device of claim 16 .

18. A lighting apparatus comprising the optical semiconductor device of claim 16 .

Assignees

• Lg Chemical Ltd

Inventors

• Ko Min Jin
• Kim Kyung Mi
• Park Young Ju
• Choi Bum Gyu
• Kang Dae Ho
• Cho Byung Kyu
• Yang You Na

Classifications

• H10W74/476

  Organic materials comprising silicon · CPC title

• C08G77/14

  containing silicon bound to oxygen-containing groups · CPC title

• C08G77/80

  Siloxanes having aromatic substituents, e.g. phenyl side groups · CPC title

• C08L83/04 Primary

  Polysiloxanes · CPC title

• C08L2203/206

  use in coating or encapsulating of electronic parts · CPC title