Composition

Patent metadata

Field	Value
Publication number	US-9240565-B2
Application number	US-201414297488-A
Country	US
Kind code	B2
Filing date	Jun 5, 2014
Priority date	Jun 6, 2013
Publication date	Jan 19, 2016
Grant date	Jan 19, 2016

Abstract

A suitable composition for manufacturing components and devices is disclosed.

First claim

What is claimed is:

1. A composition, comprising:
a first compound represented by Formula II or Formula III,

wherein R 5 independently represents a hydrogen atom, a linear alkyl group, or a cyclic alkyl group,
R 6 independently represents a linear alkylene group or a cyclic alkylene group,
R 7 independently represents a hydrogen atom, a linear alkyl group, or a cyclic alkyl group,
R 8 independently represents a linear alkylene group or a cyclic alkylene group,
R 9 independently represents a linear alkylene group or a cyclic alkylene group, and
R 10 independently represents a hydrogen atom, a linear alkyl group, or a cyclic alkyl group;

a second compound represented by Formula I,

where R 1 independently represents a hydrogen atom, a linear alkyl group, or a cyclic alkyl group,
R 2 independently represents a linear alkylene group or a cyclic alkylene group,
R 3 independently represents an aryl group, a linear alkyl group, or a cyclic alkyl group,
R 4 independently represents an aryl group, a linear alkyl group, or a cyclic alkyl group,
k represents a natural number from one to three, and
m represents an integer from zero to two; and

a third compound including a third polymerizable group.

2. The composition according to claim 1 , wherein the third compound further includes a fourth polymerizable group.

3. The composition according to claim 1 , further comprising:
a fourth compound that includes a bond cleaved by irradiation of the fourth compound.

4. The composition according to claim 1 , wherein the second compound is a silane-coupling reagent.

5. The composition of claim 1 , wherein
the first compound constitutes 0.01 wt %-10 wt % of the composition;
the second compound constitutes 0.1 wt %-50 wt % of the composition; and
the third compound constitutes 46 wt %-95.9 wt % of the composition.

6. The composition of claim 1 , wherein the first compound is represented by Formula III.

7. A component, comprising:
an inorganic portion as a member; and
an organic portion formed by curing the composition of claim 1 , wherein the composition further includes a first polymer containing an acidic group.

8. The component according to claim 7 , wherein the organic portion includes a plurality of silicon atoms each of which is bonded to respective carbon atom(s).

9. The component according to claim 8 , wherein each of the plurality of silicon atoms is bonded to an oxygen atom included in the inorganic portion.

10. The component according to claim 8 , wherein each of the plurality of silicon atoms is covalently-bonded to an oxygen atom included in the inorganic portion.

11. A method for manufacturing a component, the method comprising:
providing a member;
disposing the composition of claim 1 on the member; and
curing the composition on the member.

12. The method according to claim 11 , wherein:
the member includes an inorganic portion; and
disposing the composition is carried out such that the composition contacts the inorganic portion of the member before curing takes place.

13. The method according to claim 11 , wherein the inorganic portion is constituted of silicon oxide or silicon.

14. A method for manufacturing a component, the method comprising:
disposing a composition onto a member, the composition comprising:
a first compound that includes an acidic group and a first polymerizable group; and
a second compound that includes a silicon atom, an oxygen atom bonded to the silicon atom, a hydrocarbon group bonded to the oxygen atom, and a second polymerizable group on the member; and

curing the composition on the member such that the composition is sandwiched between the member and a mold;
wherein the mold includes:
a first surface where a plurality of first portions and a plurality of second portions are formed; and
a second surface,
wherein a first distance between the plurality of first portions and the second surface is greater than a second distance between the plurality of second portions and the second surface so as to manufacture the component.

15. The method according to claim 14 , wherein the first compound is represented by Formula II or Formula III,

wherein
R 5 independently represents a hydrogen atom, a linear alkyl group, or a cyclic alkyl group,
R 6 independently represents a linear alkylene group or a cyclic alkylene group,
R 7 independently represents a hydrogen atom, a linear alkyl group, or a cyclic alkyl group,
R 8 independently represents a linear alkylene group or a cyclic alkylene group,
R 9 independently represents a linear alkylene group or a cyclic alkylene group, and
R 10 independently represents a hydrogen atom, a linear alkyl group, or a cyclic alkyl group; and
the second compound is represented by Formula I,

wherein R 1 independently represents a hydrogen atom, a linear alkyl group, or a cyclic alkyl group,
R 2 independently represents a linear alkylene group or a cyclic alkylene group,
R 3 independently represents an aryl group, a linear alkyl group, or a cyclic alkyl group,
R 4 independently represents an aryl group, a linear alkyl group, or a cyclic alkyl group,
k represents a natural number from one to three, and
m represents an integer from zero to two.

16. A method for manufacturing a component, the method comprising:
providing a member including an inorganic portion;
disposing the composition of claim 1 onto the inorganic portion of the member; and
curing the composition thereon.

17. A method for manufacturing a device, the method comprising:
curing the composition of claim 1 disposed onto a member so as to form the device.

18. The method according to claim 17 , further comprising:
forming a first functional layer in the device in which a metal portion is formed.

19. The method according to claim 18 , further comprising:
forming a second functional layer in the device in which a semiconductor film is formed.

20. The method according to claim 17 , wherein the device is an electro-optical device.

21. The method according to claim 17 , the method further comprising:
forming a first functional layer in the device in which a metal wire is formed; and
forming a second functional layer in the device in which a semiconductor film is formed, wherein the metal wire is electrically connected to the semiconductor film in the device.

Assignees

• Toyo Gosei Co Ltd

Inventors

• Osaki Takeshi
• Naruse Kana
• Miyazawa Takashi

Classifications

• H10K50/84

  Passivation; Containers; Encapsulations · CPC title

• H10K50/844 Primary

  Encapsulations · CPC title

• H01L51/5237 Primary

  Electricity · mapped topic

• H01L51/5253

  Electricity · mapped topic