Display device
US-2024385479-A1 · Nov 21, 2024 · US
US9239489B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9239489-B2 |
| Application number | US-201213568949-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 7, 2012 |
| Priority date | Jul 31, 2012 |
| Publication date | Jan 19, 2016 |
| Grant date | Jan 19, 2016 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
An electronic device may be provided with a display having backlight structures that include a light guide plate formed from a clear polymer film. The polymer film may have an edge into which light is emitted from an adjacent array of light-emitting diodes. The light emitting diodes may each include a semiconductor device that emits light. The semiconductor device in each diode may be mounted on lead frame structures and wirebonded to the lead frame structures with first and second wire bonds. To improve backlight homogeneity and thereby reduce the mixing distance for light in the light guide plate, the diodes may be spaced closely together using diode packages having end faces that are free of lead frame structures. Exposed lead frame structures for soldering the light-emitting diodes to a substrate may be formed under the light-emitting diodes and on rear surfaces of the light-emitting diodes.
Opening claim text (preview).
What is claimed is: 1. Display backlight structures, comprising: a light guide plate having an edge; a dielectric substrate layer having solder pads; and light-emitting diodes arranged in a row along the edge that emit light into the edge, wherein each light-emitting diode includes a package having opposing front and rear surfaces, wherein each light-emitting diode includes first and second lead frame structures and a semiconductor device mounted to and wirebonded to one of th…
Electricity · mapped topic
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Related publications grouped by family.
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Answers are generated from the same data shown on this page.