Room temperature and humidity thickening thermo-conductive silicon grease composition

Patent metadata

Field	Value
Publication number	US-9238734-B2
Application number	US-201214123882-A
Country	US
Kind code	B2
Filing date	May 17, 2012
Priority date	Jul 29, 2011
Publication date	Jan 19, 2016
Grant date	Jan 19, 2016

Abstract

Provided is a room temperature and humidity thickening thermo-conductive silicone grease composition with high shape retention characteristics and good workability despite a low viscosity in an initial phase. Essential components of the room temperature and humidity thickening thermo-conductive silicone grease composition of the present invention are: (A) organopolysiloxane with a viscosity of between 0.1 Pa·s and 1,000 Pa·s at 25° C. with both ends being blocked by a hydroxyl group; (B) organopolysiloxane represented by general equation (1)

(R 1 is independently a substituted or non-substituted monovalent hydrocarbon group, R 2 is independently an alkyl group, alkoxy alkyl group, alkenyl group, or acyl group, n is an integer between 2 and 100, and a is an integer between 1 and 3); (C) a silane compound which contains at least three hydrolysable groups bonded to a silicon atom in one molecule and/or a (partial) hydrolyzate or a (partial) hydrolysis condensate thereof; (D) a thickening catalyst; (E) a thermally conductive filler with a thermal conductivity of at least 10 W/m·° C.; and (F) silica fine powder.

First claim

The invention claimed is:

1. A heat-conductive silicone grease composition adapted to thicken with moisture at room temperature, comprising as essential components,
(A) 5 to 50 parts by weight of an organopolysiloxane capped at both ends with a hydroxyl group and having a viscosity of 0.1 to 1,000 Pa·s at 25° C.,
(B) 50 to 95 parts by weight of an organopolysiloxane represented by the general formula (1):

wherein
R 1 is independently a substituted or unsubstituted monovalent hydrocarbon group,
R 2 is independently an alkyl, alkoxyalkyl, alkenyl or acyl group,
n is an integer of 2 to 80, and
a is an integer of 1 to 3,
the sum of components (A) and (B) being 100 parts by weight,

(C) 1 to 30 parts by weight of a silane compound containing at least three silicon-bonded hydrolysable groups per molecule and/or a (partial) hydrolyzate or (partial) hydrolytic condensate thereof,
(D) 0.01 to 20 parts by weight of a thickening catalyst in the form of a silane or siloxane containing a guanidyl group,
(E) 100 to 2,000 parts by weight of a heat conductive filler having a thermal conductivity of at least 10 W/m·° C., and
(F) silica fine powder in an amount of 10 to 100 parts by weight per 100 parts by weight of component (A).

2. The heat-conductive silicone grease composition of claim 1 , further comprising
(G) an organosilane represented by the general formula (2) and/or a partial hydrolytic condensate thereof in an amount of 0.1 to 20 parts by weight per 100 parts by weight of components (A) and (B) combined,
R 3 b R 4 c Si(OR 5 ) 4-b-c   (2)

wherein R 3 is independently a substituted or unsubstituted alkyl group of 6 to 20 carbon atoms, R 4 is independently a substituted or unsubstituted monovalent hydrocarbon group of 1 to 20 carbon atoms, R 5 is independently an alkyl group of 1 to 6 carbon atoms, b is an integer of 1 to 3, c is an integer of 0 to 2, and b+c is an integer of 1 to 3.

3. The heat-conductive silicone grease composition of claim 1 , further comprising
(H) an organopolysiloxane represented by the average compositional formula (3) and having a viscosity of 0.05 to 1,000 Pa·s at 25° C., in an amount of 10 to 1,000 parts by weight per 100 parts by weight of components (A) and (B) combined,
R 6 d SiO (4-d)/2   (3)

wherein R 6 is independently a substituted or unsubstituted monovalent hydrocarbon group of 1 to 18 carbon atoms, and d is a positive number of 1.8 to 2.2.

4. The heat-conductive silicone grease composition of claim 1 or 2 , further comprising
(I) a silane compound having a group bonded to a silicon atom via a carbon atom, selected from the class consisting of amino, epoxy, mercapto, acryloyl and methacryloyl, and a silicon-bonded hydrolysable group and/or a partial hydrolytic condensate thereof in an amount of 0.01 to 30 parts by weight per 100 parts by weight of components (A) and (B) combined.

5. The heat-conductive silicone grease composition of claim 1 or 2 wherein the silica fine powder as component (F) is surface-treated fumed silica.

6. The heat-conductive silicone grease composition of claim 1 , wherein the organopolysiloxane of component (A) has the following general formula (4):

wherein R 7 is each independently a substituted or unsubstituted, monovalent hydrocarbon group of 1 to 8 carbon atoms, and the subscript m is such a number that the organopolysiloxane of formula (4) has a viscosity of 0.1 to 1,000 Pa·s.

7. The heat-conductive silicone grease composition of claim 1 , wherein the silane compound of component (C) has the following general formula (5):
R 8 e SiX 4-e   (5)

wherein R 8 is a substituted or unsubstituted monovalent hydrocarbon group of 1 to 10 carbon atoms, X is a hydrolyzable group, and the subscript e is 0 or 1.

8. A heat-conductive silicone grease composition adapted to thicken with moisture at room temperature, consisting of
(A) 5 to 50 parts by weight of an organopolysiloxane capped at both ends with a hydroxyl group and having a viscosity of 0.1 to 1,000 Pa·s at 25° C.,
(B) 50 to 95 parts by weight of an organopolysiloxane represented by the general formula (1):

wherein R 1 is independently a substituted or unsubstituted monovalent hydrocarbon group, R 2 is independently an alkyl, alkoxyalkyl, alkenyl or acyl group, n is an integer of 2 to 80, and a is an integer of 1 to 3, the sum of components (A) and (B) being 100 parts by weight,
(C) 1 to 30 parts by weight of a silane compound containing at least three silicon-bonded hydrolysable groups per molecule and/or a (partial) hydrolyzate or (partial) hydrolytic condensate thereof,
(D) 0.01 to 20 parts by weight of a thickening catalyst,
(E) 100 to 2,000 parts by weight of a heat conductive filler having a thermal conductivity of at least 10 W/m·° C., and
(F) silica fine powder in an amount of 10 to 100 parts by weight per 100 parts by weight of component (A).

9. A heat-conductive silicone grease composition adapted to thicken with moisture at room temperature, consisting of
(A) 5 to 50 parts by weight of an organopolysiloxane capped at both ends with a hydroxyl group and having a viscosity of 0.1 to 1,000 Pa·s at 25° C.,
(B) 50 to 95 parts by weight of an organopolysiloxane represented by the general formula (1):

wherein R 1 is independently a substituted or unsubstituted monovalent hydrocarbon group, R 2 is independently an alkyl, alkoxyalkyl, alkenyl or acyl group, n is an integer of 2 to 80, and a is an integer of 1 to 3, the sum of components (A) and (B) being 100 parts by weight,
(C) 1 to 30 parts by weight of a silane compound containing at least three silicon-bonded hydrolysable groups per molecule and/or a (partial) hydrolyzate or (partial) hydrolytic condensate thereof,
(D) 0.01 to 20 parts by weight of a thickening catalyst,
(E) 100 to 2,000 parts by weight of a heat conductive filler having a thermal conductivity of at least 10 W/m·° C.,
(F) silica fine powder in an amount of 10 to 100 parts by weight per 100 parts by weight of component (A), and
any one or more of the following components (G) to (I):
(G) an organosilane represented by the general formula (2) and/or a partial hydrolytic condensate thereof in an amount of 0.1 to 20 parts by weight per 100 parts by weight of components (A) and (B) combined
R 3 b R 4 c Si(OR 5 ) 4-b-c   (2)

wherein R 3 is independently a substituted or unsubstituted alkyl group of 6 to 20 carbon atoms, R 4 is independently a substituted or unsubstituted monovalent hydrocarbon group of 1 to 20 carbon atoms, R 5 is independently an alkyl group of 1 to 6 carbon atoms, b is an integer of 1 to 3, c is an integer of 0 to 2, and b+c is an integer of 1 to 3,
(H) an organopolysiloxane represented by the average compositional formula (3) and having a viscosity of 0.05 to 1,000 Pa·s at 25° C., in an amount of 10 to 1,000 parts by weight per 100 parts by weight of components (A) and (B) combined
R 6 d SiO (4-d)/2   (3)

wherein R 6 is independently a substituted or unsubstituted monovalent hydrocarbon group of 1 to 18 carbon atoms, and d is a positive number of 1.8 to 2.2, and
(I) a silane compound having a group bonded to a silicon atom via a carbon atom, selected from the class consisting of amino, epoxy, mercapto, acryloyl and methacryloyl,

Assignees

• Matsumoto Nobuaki
• Kameda Norio
• Teshigawara Mamoru
• Shinetsu Chemical Co

Inventors

• Matsumoto Nobuaki
• Kameda Norio
• Teshigawara Mamoru

Classifications

• C08G77/26

  nitrogen-containing groups · CPC title

• C08G77/16

  to hydroxy groups · CPC title

• C08L2205/02

  containing two or more polymers of the same C08L -group · CPC title

• C08L83/06 Primary

  containing silicon bound to oxygen-containing groups (C08L83/12 takes precedence) · CPC title

• C08G77/14

  containing silicon bound to oxygen-containing groups · CPC title