Method and system for producing component mounting board

Patent metadata

Field	Value
Publication number	US-9237686-B2
Application number	US-201314119148-A
Country	US
Kind code	B2
Filing date	Feb 26, 2013
Priority date	Aug 10, 2012
Publication date	Jan 12, 2016
Grant date	Jan 12, 2016

Abstract

A wiring board on which an electronic component is to be mounted includes a resist having an opening exposing a joint face which is part of the surface of a wiring layer and to which a terminal of the electronic component is to be joined. In the placing step, the electronic component is placed on the wiring board such that the terminal covers the opening entirely and contacts the solder paste applied onto the joint face. Next, the solder paste applied onto the joint face is heated to melt solder and soften thermosetting resin. This allows the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component.

First claim

The invention claimed is:

1. A method for producing a component mounting board in which an electronic component is mounted on a wiring board, the wiring board comprising an insulated board, a wiring layer formed on a surface of the insulated board, and a resist covering the wiring layer, and the resist having an opening exposing a joint face which is part of a surface of the wiring layer and to which a terminal of the electronic component is to be electrically joined, the method comprising the steps of:
(a) applying a solder paste including solder and thermosetting resin, onto the joint face;
(b) placing the electronic component on the wiring board such that the terminal of the electronic component covers the opening entirely and comes in contact with the solder paste applied onto the joint face; and
(c) after execution of the step (b), heating the solder paste applied onto the joint face, thereby to melt the solder and soften the thermosetting resin and then to cure the thermosetting resin, wherein:
in the step (c), as a result of melting of the solder and softening of the thermosetting resin, the electronic component is brought into proximity with a surface of the resist, and the solder and the thermosetting resin are separated from each other, allowing the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component, and
communication between the first and the second spaces is blocked by the electronic component after a cooling process subsequent to step (c).

2. The method for producing a component mounting board according to claim 1 , wherein in the step (a), the solder paste is applied such that a total volume of the solder included in the solder paste on the joint face becomes substantially equal to a volume of the first space.

3. The method for producing a component mounting board according to claim 1 , wherein in the step (b), the electronic component is placed on the wiring board, with an underside of the electronic component being spaced apart from the surface of the resist.

4. The method for producing a component mounting board according to claim 1 , wherein in the step (a), the solder paste is applied on the joint face such that a total volume of the solder included in the solder paste becomes 95% to 100% of a volume of the first space.

5. A method for producing a component mounting board in which an electronic component is mounted on a wiring board, the wiring board comprising an insulated board, a wiring layer formed on a surface of the insulated board, and a resist covering the wiring layer, and the resist having an opening exposing a joint face which is part of a surface of the wiring layer and to which a terminal of the electronic component is to be electrically joined, the method comprising steps of:
(a) applying a solder paste including solder and thermosetting resin, onto the joint face;
(b) placing the electronic component on the wiring board such that the terminal of the electronic component covers the opening entirely and comes in contact with the solder paste applied onto the joint face;
(c) after execution of the step (b), heating the solder paste applied onto the joint face, thereby to melt the solder and soften the thermosetting resin such that the electronic component is brought into proximity with a surface of the resist, and the solder and the thermosetting resin are separated from each other, and then to cure the thermosetting resin to form a cured material; and
(d) after execution of step (c), executing cooling process to solidify the solder such that the wiring board and the electronic component are electrically joined to each other via the solidified solder in the first space within the opening closed with the wiring layer and the electronic component, and the wiring board and the electronic component are mechanically joined to each other via the cured material in the second space formed between a top side of the resist and a lateral side of the electronic component,
wherein the cured material in the second space does not come in contact with the solder in the first space.

6. The method for producing a component mounting board according to claim 5 , wherein in the step (a), the solder paste is applied on the joint face such that a total volume of the solder included in the solder paste becomes 95% to 100% of a volume of the first space.

Assignees

• Panasonic Corp
• Panasonic Ip Man Co Ltd

Inventors

• Motomura Koji
• Kishi Arata
• Maruo Hiroki
• Suzuki Yasuhiro
• Munakata Hironori

Classifications

• H10W72/879

  Bump connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/944

  Dispositions of multiple bond pads · CPC title

• H10W72/941

  Dispositions of bond pads · CPC title

• H10W72/922

  Bond pads being integral with underlying chip-level interconnections · CPC title