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Semiconductor module cooler and semiconductor module
US9237676B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9237676-B2 |
| Application number | US-201214110856-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 16, 2012 |
| Priority date | Apr 26, 2011 |
| Publication date | Jan 12, 2016 |
| Grant date | Jan 12, 2016 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A semiconductor module cooler supplies a coolant to a water jacket from outside and cools a semiconductor device arranged on an outer surface of the cooler. The semiconductor module cooler has a heat sink thermally connected to the semiconductor device; a first flow channel arranged inside the water jacket with a guide section extending from a coolant inlet and having an inclined surface for guiding the coolant toward one side surface of the heat sink; a second flow channel arranged inside the water jacket in parallel to the first flow channel and extending to a coolant outlet; and a third flow channel formed inside the water jacket at a position connecting the first flow channel and the second flow channel. The coolant inlet and the coolant outlet are formed on a same wall surface of the water jacket, and the heat sink is arranged in the third flow channel.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor module cooler for supplying a coolant to a water jacket from outside and cooling a semiconductor device arranged on an outer surface of the cooler, the semiconductor module cooler comprising: a heat sink thermally connected to the semiconductor device; a first flow channel arranged inside the water jacket with a guide section extending from a coolant inlet and having an inclined surface for guiding the coolant toward one side surface of the…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H10W40/255Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9237676B2 cover?
- A semiconductor module cooler supplies a coolant to a water jacket from outside and cools a semiconductor device arranged on an outer surface of the cooler. The semiconductor module cooler has a heat sink thermally connected to the semiconductor device; a first flow channel arranged inside the water jacket with a guide section extending from a coolant inlet and having an inclined surface for gu…
- Who is the assignee on this patent?
- Gohara Hiromichi, Morozumi Akira, Ichimura Takeshi, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10W40/255. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).