Electronic component package and piezoelectric resonator device

Patent metadata

Field	Value
Publication number	US-9237668-B2
Application number	US-201213881175-A
Country	US
Kind code	B2
Filing date	Apr 19, 2012
Priority date	Jun 15, 2011
Publication date	Jan 12, 2016
Grant date	Jan 12, 2016

Abstract

In an electronic-component package made up of a laminated-ceramic, cavity-forming base and an electroconductive lid that is hermetically bonded to the base by a heat-melting sealant, contamination of electromagnetic-interference-reducing grounding metallization lines by melted sealant is prevented. A wall-portion grounding metallization line partially embedded in an enclosing wall portion of the base, and partially exposed to the package cavity, electrically connects lid, when sealant-bonded to the wall portion of the base, with a grounding external terminal on the base exterior. An electronic-component grounding metallization line exposed in the bottom of the base is connected to the grounding external terminal. A connecting portion that joins the wall-portion and electronic-component grounding metallization lines is disposed between laminations of the bottom and wall portions of the base, where the connecting portion is unexposed to the package cavity.

First claim

The invention claimed is:

1. An electronic component package, comprising:
a base on which an electronic component element is mounted, the base including a bottom portion and a wall portion extending from the bottom portion; and
a lid bonded to the base with a sealing member so as to hermetically seal the electronic component element, the lid including a conductive member;
wherein the base includes:
a cavity formed on a first main surface of the base by the bottom portion and the wall portion, the cavity on which is mounted the electronic component element;
electrode pads electrically connected to electrodes of the electronic component element;
external terminals electrically connected to outside; and
line patterns electrically connected to the electrode pads and the external terminals,
wherein the external terminals include a GND terminal for grounding,
wherein the line patterns include:
a wall portion GND line pattern formed on the wall portion to be exposed in the cavity so as to connect the lid to the GND terminal; and
an electronic component element GND line pattern formed on the first main surface of the base in the cavity so as to connect the electronic component element to the GND terminal, and
wherein a connecting portion that connects the electronic component element GND line pattern to the wall portion GND line pattern is disposed between layers of the bottom portion and the wall portion in plane view of the base, without presenting a surface to the cavity, and wherein surfaces of the connecting portion are covered by the bottom portion and the wall portion.

2. The electronic component package according to claim 1 ,
wherein the connecting portion is disposed between layers of the bottom portion and the wall portion, without being exposed in the cavity.

3. The electronic component package according to claim 1 ,
wherein a recess portion is provided in a wall surface of the wall portion in the cavity, and
wherein the wall portion GND line pattern is formed in the recess portion.

4. The electronic component package according to claim 3 ,
wherein a wall portion GND electrode is formed on the bottom portion, the wall portion GND electrode being a part of the wall portion GND line pattern,
wherein a portion of the wall portion GND electrode is exposed in the cavity,
wherein an outer end edge of the exposed portion of the wall portion GND electrode in the cavity has a shape along the wall surface of the wall portion in the cavity, and
wherein an outer end edge of a non-exposed portion of the wall portion GND electrode has a circular shape.

5. The electronic component package according to claim 3 ,
wherein a wall portion GND electrode is formed on the bottom portion, the wall portion GND electrode being a part of the wall portion GND line pattern,
wherein an outer end edge of the wall portion GND electrode has an ellipse shape, and
wherein one minor axis of the ellipse is partially exposed in the cavity.

6. The electronic component package according to claim 3 ,
wherein a wall portion GND electrode is formed on the bottom portion, the wall portion GND electrode being a part of the wall portion GND line pattern,
wherein a portion of the wall portion GND electrode is exposed in the cavity,
wherein an outer end edge of the exposed portion of the wall portion GND electrode in the cavity is a straight line, and
wherein an outer end edge of a non-exposed portion of the wall portion GND electrode has a circular shape.

7. A piezoelectric resonator device,
wherein a piezoelectric element as an electronic component element is hermetically sealed in the electronic component package according to claim 1 .

8. An electronic component package, comprising:
a laminated base having a cavity therein and composed of a bottom portion having an electronic-component mounting surface, and an enclosing wall portion extending from the electronic-component mounting surface;
external electrical-connection terminals formed exteriorly on the base, the external terminals including a grounding external terminal;
an electroconductive lid bonded to the wall portion of the base so as to hermetically seal into the cavity in the base an electronic component mounted on the electronic-component mounting surface;
a wall-portion grounding metallization line formed in the wall portion of the base and electrically connected to the electroconductive lid via sealant-bonding to the wall portion of the base, with the grounding external terminal on the base exterior, and such as to be exposed to the cavity in the base; and
metallization formed integrally with the bottom portion of the base, the metallization including
electrode pads exposed on the electronic-component mounting surface, for forming electrical connections with electronic-component electrodes,
metallization lines electrically connecting the electrode pads and external terminals other than the grounding external terminal,
an electronic-component grounding metallization line for electrically connecting an electronic component mounted in the cavity in the base with the grounding external terminal, and
a connecting portion that lacks a surface in the cavity and that electrically connects the electronic-component grounding metallization line with the wall-portion grounding metallization line, the connecting portion being disposed between, when the base is seen in planar view, laminations of the bottom and wall portions of the base.

9. The electronic component package according to claim 8 , wherein:
a recess portion is provided in a cavity wall surface of the enclosing wall portion of the base; and
the wall-portion grounding metallization line is formed in the recess portion.

10. The electronic component package according to claim 9 , wherein the wall-portion grounding metallization line comprises a wall-portion grounding electrode having an exposed portion exposed to the cavity in the base, the remainder of the grounding electrode being a non-exposed portion, the exposed portion having a shaped outer edge along the cavity wall surface of the enclosing wall portion of the base, and the non-exposed portion having a circular outer edge.

11. The electronic component package according to claim 9 , wherein the wall-portion grounding metallization line comprises a wall-portion grounding electrode of elliptical form, a minor-axis portion of the elliptical grounding electrode being partially exposed to the cavity in the base.

12. The electronic component package according to claim 9 , wherein the wall-portion grounding metallization line comprises a wall-portion grounding electrode having an exposed portion exposed to the cavity in the base, the remainder of the grounding electrode being a non-exposed portion, the exposed portion being rectilinear, and the non-exposed portion having a circular outer edge.

13. A piezoelectric resonator device, wherein a piezoelectric element as an electronic component element is hermetically sealed in the electronic component package according to claim 8 .

Assignees

• Kojo Takuya
• Daishinku Corp

Inventors

• Kojo Takuya

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W76/60 Primary

  Seals · CPC title

• H01L2224/16225

  Electricity · mapped topic

• B81B2201/0271

  Resonators; ultrasonic resonators · CPC title

• H01L23/10

  Electricity · mapped topic