Electronic circuit apparatus

Patent metadata

Field	Value
Publication number	US-9237653-B2
Application number	US-201314425558-A
Country	US
Kind code	B2
Filing date	Aug 30, 2013
Priority date	Sep 13, 2012
Publication date	Jan 12, 2016
Grant date	Jan 12, 2016

Abstract

For an electronic circuit apparatus including a shunt resistor, provided is a measure for improving the heat dissipation performance of the shunt resistor. The shunt resistor includes electrodes at both ends. One of the two electrodes is connected to a surface-mounting pattern on which the shunt resistor is surface-mounted. A current-generating-side pattern and a current-receiving-side pattern are arranged separately from the surface-mounting pattern. The current-generating-side pattern and the surface-mounting pattern are connected together via a connection member which creates a space between itself and a substrate.

First claim

The invention claimed is:

1. An electronic circuit apparatus in which a shunt resistor, including a resistance element between electrodes, is surface-mounted to a substrate and in which electric current flowing from a current-generating-side pattern into a current-receiving-side pattern is detected by the shunt resistor that is arranged on a path of the electric current, wherein
at least one of the electrodes of the shunt resistor is connected to a surface-mounting pattern on which the shunt resistor is surface-mounted, and
the surface-mounting pattern is connected to the current-generating-side pattern or the current-receiving-side pattern via a connection member which creates a space between the connection member itself and the substrate.

2. The electronic circuit apparatus of claim 1 , wherein
the connection member is a bus bar made of a conductor having high thermal conductivity.

3. The electronic circuit apparatus of claim 2 , wherein
at a point where the electrode of the shunt resistor is connected to the surface-mounting pattern, the surface-mounting pattern has a width set to be equal to the length of the electrode of the shunt resistor.

4. The electronic circuit apparatus of claim 3 , wherein
the connection member includes
a leg arranged on the upper surface of the surface-mounting pattern and having a predetermined height,
a leg arranged on the upper surface of the current-generating-side pattern or the current-receiving side pattern and having a predetermined height, and
a connector connecting the legs together.

5. The electronic circuit apparatus of claim 4 , wherein
the current-generating-side pattern is divided into a plurality of sub-patterns each including one current-generating point, and
the sub patterns are connected to the surface-mounting pattern for the shunt resistor via connection members, respectively.

6. The electronic circuit apparatus of claim 3 , wherein
the current-generating-side pattern is divided into a plurality of sub-patterns each including one current-generating point, and
the sub patterns are connected to the surface-mounting pattern for the shunt resistor via connection members, respectively.

7. The electronic circuit apparatus of claim 2 , wherein
the connection member includes
a leg arranged on the upper surface of the surface-mounting pattern and having a predetermined height,
a leg arranged on the upper surface of the current-generating-side pattern or the current-receiving-side pattern and having a predetermined height, and
a connector connecting the legs together.

8. The electronic circuit apparatus of claim 7 , wherein
the current-generating-side pattern is divided into a plurality of sub-patterns each including one current-generating point, and
the sub patterns are connected to the surface-mounting pattern for the shunt resistor via connection members, respectively.

9. The electronic circuit apparatus of claim 2 , wherein
the current-generating-side pattern is divided into a plurality of sub-patterns each including one current-generating point, and
the sub patterns are connected to the surface-mounting pattern for the shunt resistor via connection members, respectively.

10. The electronic circuit apparatus of claim 1 , wherein
at a point where the electrode of the shunt resistor is connected to the surface-mounting pattern, the surface-mounting pattern has a width set to be equal to the length of the electrode of the shunt resistor.

11. The electronic circuit apparatus of claim 10 , wherein
the connection member includes
a leg arranged on the upper surface of the surface-mounting pattern and having a predetermined height,
a leg arranged on the upper surface of the current-generating-side pattern or the current-receiving-side pattern and having a predetermined height, and
a connector connecting the legs together.

12. The electronic circuit apparatus of claim 11 , wherein
the current-generating-side pattern is divided into a plurality of sub-patterns each including one current-generating point, and
the sub patterns are connected to the surface-mounting pattern for the shunt resistor via connection members, respectively.

13. The electronic circuit apparatus of claim 10 , wherein
the current-generating-side pattern is divided into a plurality of sub-patterns each including one current-generating point, and
the sub patterns are connected to the surface-mounting pattern for the shunt resistor via connection members, respectively.

14. The electronic circuit apparatus of claim 1 , wherein
the connection member includes
a leg arranged on the upper surface of the surface-mounting pattern and having a predetermined height,
a leg arranged on the upper surface of the current-generating-side pattern or the current-receiving-side pattern and having a predetermined height, and
a connector connecting the legs together.

15. The electronic circuit apparatus of claim 14 , wherein
the current-generating-side pattern is divided into a plurality of sub-patterns each including one current-generating point, and
the sub patterns are connected to the surface-mounting pattern for the shunt resistor via connection members, respectively.

16. The electronic circuit apparatus of claim 1 , wherein
the current-generating-side pattern is divided into a plurality of sub-patterns each including one current-generating point, and
the sub patterns are connected to the surface-mounting pattern for the shunt resistor via connection members respectively.

Assignees

• Daikin Ind Ltd

Inventors

• Kondou Rei
• Tanaka Mitsuhiro
• Koyama Yoshitsugu

Classifications

• H02P6/28

  Arrangements for controlling current (H02P6/10 takes precedence) · CPC title

• H01C13/00

  Resistors not provided for elsewhere · CPC title

• H01C1/084

  using self-cooling, e.g. fins, heat sinks · CPC title

• H05K1/0296

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• H05K2201/10022

  Non-printed resistor · CPC title