Method for joining wire ends

Patent metadata

Field	Value
Publication number	US-9236701-B2
Application number	US-201113816340-A
Country	US
Kind code	B2
Filing date	Jul 29, 2011
Priority date	Aug 30, 2010
Publication date	Jan 12, 2016
Grant date	Jan 12, 2016

Abstract

By a wire end joining method, conductors are integrally joined to each other by applying ultrasonic vibration in a predetermined direction to a conductor bundle obtained by bundling the conductors exposed from a plurality of wires. In a conductor bundle forming process, the conductor bundle is formed by bundling the conductors while interposing metallic foils or plates between the conductors adjacent in a predetermined direction which is an applying direction of the ultrasonic vibration. In an ultrasonic joining process, the conductors are integrally joined to each other by applying the ultrasonic vibration to the formed conductor bundle while pressing the formed conductor bundle in the predetermined direction.

First claim

The invention claimed is:

1. A wire end joining method for integrally joining two or more conductors to each other by applying ultrasonic vibration in a predetermined direction to a conductor bundle obtained by bundling the two or more conductors exposed from a plurality of wires, the wire end joining method comprising:
a conductor bundle forming process for forming the conductor bundle by bundling the two or more conductors while interposing metallic foils or plates between the two or more conductors adjacent in a predetermined direction which is an applying direction of the ultrasonic vibration, wherein the metallic foils or plates include two or more respective conductor receiving spaces into which the two or more conductors are respectively accommodated; and
an ultrasonic joining process for integrally joining the two or more conductors to each other by applying the ultrasonic vibration to the formed conductor bundle while pressing the formed conductor bundle in the predetermined direction.

2. The wire end joining method according to claim 1 , further comprising:
a conductor bundle compressing process for pre-compressing the conductor bundle formed by the conductor bundle forming process in the predetermined direction which indicates both the applying direction of the ultrasonic vibration and a pressing direction when the ultrasonic vibration is applied is carried out, and then the conductor bundle is subjected to an ultrasonic joining process.

3. The wire end joining method according to claim 1 , wherein
the metallic foils or plates have a shape which can temporarily hold the wire placed for the ultrasonic joining.

4. The wire end joining method according to claim 1 , wherein each of the two or more conductors are respectively formed by twisting a plurality of strands together.

Assignees

• Nabeta Yasunori
• Ito Naoki
• Yazaki Corp

Inventors

• Nabeta Yasunori
• Ito Naoki

Classifications

• H01R4/027

  comprising means for positioning or holding the parts to be soldered or welded · CPC title

• H01R43/0207 Primary

  Ultrasonic-, H.F.-, cold- or impact welding · CPC title

• H01R43/02

  for soldered or welded connections · CPC title

• H01R4/02 Primary

  Soldered or welded connections {(H01R4/625, H01R4/723, H01R12/59 take precedence)} · CPC title

• B23K1/06

  making use of vibrations, e.g. supersonic vibrations · CPC title