Heat conducting slug having multi-step structure and light emitting diode package using the same

Patent metadata

Field	Value
Publication number	US-9236549-B2
Application number	US-51995407-A
Country	US
Kind code	B2
Filing date	Dec 18, 2007
Priority date	Dec 19, 2006
Publication date	Jan 12, 2016
Grant date	Jan 12, 2016

Abstract

The present invention provides a heat conducting slug having a multi-step structure, which is installed to an LED package to dissipate heat generated from a light emitting chip to the outside. The heat conducting slug includes a first slug, a second slug formed on the first slug, and a third slug formed on the second slug, wherein the light emitting chip is mounted to the third slug, and the second and third slugs respectively shaped to have edges are arranged to cross each other. In this configuration, heat generated from a light emitting chip follows a heat dissipation path, in which the heat is gathered at edges of one slug and dissipated therefrom and then gathered toward edges of another slug, arranged to cross the one slug. Accordingly, the entire heat dissipation path is not concentrated at a specific region but generally distributed widely, thereby improving a heat dissipation effect of the heat conducting slug.

First claim

The invention claimed is:

1. A heat conducting slug for dissipating heat from a light emitting chip disposed thereon, the heat conducting slug comprising:
a first slug;
a second slug disposed on the first slug; and
a third slug disposed on the second slug opposite to the first slug such that the second slug is disposed between the first slug and the third slug,
wherein the second slug and the third slug are respectively shaped to have edges, and the edges of the second slug and the edges of the third slug are arranged to cross each other,
wherein the second slug is entirely disposed within the perimeter of the first slug, and
wherein heat from the light emitting chip is configured to flow through the third slug to the second slug and then the first slug.

2. The heat conducting slug of claim 1 , wherein each of the second slug and the third slug has a rectangular rim, the rectangular rim of the third slug is positioned within the rectangular rim of the second slug, and the rectangular rim of the third slug is arranged to be rotated 45 degrees with respect to the rectangular rim of the second slug.

3. The heat conducting slug of claim 2 , wherein the third slug comprises a concave portion configured to receive a light emitting chip.

4. The heat conducting slug of claim 3 , wherein the third slug further comprises a reflective surface on the concave portion.

5. The heat conducting slug of claim 1 , wherein the first slug, the second slug, and the third slug are monolithically formed.

6. The heat conducting slug of claim 5 , wherein the third slug comprises a concave portion configured to receive a light emitting chip, and the concave portion extends to the second slug, whereby a bottom surface of the concave portion is positioned within the second slug.

7. The heat conducting slug of claim 5 , wherein the first slug has a lead accepting step configured to be coupled to lead terminals.

8. The heat conducting slug of claim 7 , wherein the lead accepting step is continuously formed along a circumference of the first slug.

9. The heat conducting slug of claim 1 , wherein the second slug is disposed directly on the first slug.

10. The heat conducting slug of claim 1 , wherein the third slug is disposed directly on the second slug.

11. A light emitting diode (LED) package, comprising:
a housing;
a heat conducting slug mounted in the housing;
a light emitting chip disposed on the heat conducting slug; and
lead terminals,
wherein the heat conducting slug has a multi-step structure comprising a first slug; a second slug disposed on the first slug; and a third slug disposed on the second slug opposite to the first slug such that the second slug is disposed between the first slug and the third slug, the second slug and the third slug being respectively shaped to have edges, the edges of the second slug and the edges of the third slug being arranged to cross each other,
wherein the second slug is entirely disposed within the perimeter of the first slug,
wherein the light emitting chip is disposed on the third slug opposite to the second slug, and
wherein the first slug comprises a bottom surface exposed outside of the housing.

12. The LED package of claim 11 , wherein the second slug and the third slug has a rectangular rim, the rectangular rim of the third slug is positioned within the rectangular rim of the second slug, and the rectangular rim of the third slug is arranged to be rotated 45 degrees with respect to the rectangular rim of the second slug.

13. The LED package of in claim 12 , wherein the third slug comprises a concave portion configured to receive a light emitting chip.

14. The LED package of claim 11 , wherein the first slug, the second slug, and the third slug are monolithically formed.

15. The LED package of claim 14 , wherein the third slug comprises a concave portion configured to receive the light emitting chip, and the concave portion extends to the second slug, whereby a bottom surface of the concave portion is positioned within the second slug.

16. The LED package of claim 14 , further comprising support leads, wherein the support leads are coupled to the heat conducting slug.

17. The LED package of claim 16 , wherein the first slug has a lead accepting step, and the support leads are coupled to the lead accepting step.

18. The LED package of claim 16 , wherein at least one of the lead terminals is coupled and electrically connected to the heat conducting slug, and at least another one of the lead terminals is spaced apart from the heat conducting slug.

19. The LED package of claim 18 , wherein at least one of the lead terminals is coupled to the lead accepting step of the first slug.

20. The LED package of claim 18 , wherein at least one of the lead terminals and ends of the support leads are connected with each other to form a semicircular ring.

21. The LED package of claim 18 , wherein the support leads extend to form a semicircular support ring coupled to the first slug along a circumference of the first slug, and the semicircular support ring is arranged to face at least one of the lead terminals.

22. The LED package of claim 11 , wherein at least one groove is formed on an upper portion of the housing.

23. The LED package of claim 11 , wherein the second slug is disposed directly on the first slug.

24. The LED package of claim 11 , wherein the third slug is disposed directly on the second slug.

25. A light emitting diode (LED) package, comprising:
a housing;
a heat conducting slug mounted in the housing;
a light emitting chip disposed on the heat conducting slug;
at least two lead terminals; and
support leads coupled to the housing,
wherein at least one of the lead terminals is coupled and electrically connected to the heat conducting slug, and at least another one of the lead terminals is spaced apart from the heat conducting slug, the support leads extending to be connected to each other and form a semicircular support ring coupled to the heat conducting slug, the heat conducting slug being arranged between the semicircular support ring and the lead terminal coupled to the heat conducting slug, and
wherein the semicircular support ring is disposed between the at least one lead terminal coupled to the heat conducting slug and the at least another one lead terminal spaced apart from the heat conducting slug.

26. The LED package of claim 25 , wherein the semicircular support ring and the lead terminal coupled to the heat conducting slug are connected with each other to form a circular ring.

Assignees

• Lee Jong Kook
• Pyo Byoung Ki
• Choi Hyuck Jung
• Kim Kyung Nam
• Cho Won
• Seoul Semiconductor Co Ltd

Inventors

• Lee Jong Kook
• Pyo Byoung Ki
• Choi Hyuck Jung
• Kim Kyung Nam
• Cho Won

Classifications

• H10W40/10 Primary

  Arrangements for heating · CPC title

• H10H20/8585

  being an interconnection · CPC title

• H10H20/8582 Primary

  characterised by their shape · CPC title

• H01L33/642 Primary

  Electricity · mapped topic

• H01L2924/00

  Electricity · mapped topic