High density organic bridge device and method

Patent metadata

Field	Value
Publication number	US-9236366-B2
Application number	US-201213722203-A
Country	US
Kind code	B2
Filing date	Dec 20, 2012
Priority date	Dec 20, 2012
Publication date	Jan 12, 2016
Grant date	Jan 12, 2016

Abstract

Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.

First claim

What is claimed is:

1. A microelectronic package comprising;
an organic polymer substrate created using a first set of design rules having a first wire width and first wire spacing;
an organic polymer bridge embedded in the substrate, created using a second set of design rules having a second wire width and a second wire spacing;
a first interconnect structure at a first location of the organic polymer bridge and second interconnect structure at a second location of the organic polymer bridge; and
an electrically conductive path in the organic polymer bridge connecting the first interconnect structure to the second interconnect structure.

2. The microelectronic package of claim 1 wherein the organic polymer substrate contains a recess and the organic polymer bridge is embedded into the recess using an organic polymer.

3. The microelectronic package of claim 2 wherein the organic polymer substrate and the organic polymer bridge are made from the same organic polymer.

4. The microelectronic package of claim 2 wherein the organic polymer substrate and the organic polymer bridge are made from different organic polymers.

5. The microelectronic package of claim 1 wherein the first wire width is larger than the second wire width and the first wire spacing is larger than the second wire spacing.

6. The microelectronic package of claim 1 wherein the organic polymer bridge has a total thickness of less than about 20 μm.

7. An organic bridge adapted to interconnect a plurality of die, the organic bridge comprising:
a plurality of metal routing layers;
a metal pad layer;
interleaved organic polymer dielectric layers between each metal routing layer and the metal pad layer; and
wherein there is no layer made substantially of silicon.

8. The organic bridge of claim 7 wherein all layers have a combined thickness less than about 30 μm.

9. The organic bridge of claim 7 wherein all layers have a combined thickness of about 15 μm.

10. The organic bridge of claim 7 wherein the metal pad layer comprises a plurality of interconnect structures.

11. The organic bridge of claim 10 wherein a first of the plurality of interconnect structures is adapted to connect to a first die and wherein a second of the plurality of interconnect structures is adapted to connect to a second die.

12. A microelectronic package comprising:
an organic polymer package substrate created using a first set of design rules having first wire width and first wire spacing; and
an organic polymer bridge created using a second set of design rules having a second wire width and a second wire spacing, the organic polymer bridge comprising a metal pad layer, a metal routing layer and interleaved dielectric layers, the organic polymer bridge being embedded in the organic polymer package substrate.

13. The microelectronic package of claim 12 wherein the organic polymer bridge has a thickness of about 15 μm to about 20 μm.

14. A method comprising:
providing an organic bridge comprising:
a plurality of metal routing layers;
a metal pad layer;
interleaved organic polymer dielectric layers between each metal routing layer and the metal pad layer, wherein there is no layer made substantially of silicon;
providing an organic package substrate having a recess formed therein; and
bonding the organic bridge into the recess of the organic package using an organic polymer.

15. The method of claim 14 , wherein all layers of the organic bridge have a thickness of less than about 15 μm.

16. The method of claim 14 , wherein all layers of the organic bridge have a thickness of less than about 20 μm.

17. The method of claim 14 wherein the metal pad layer comprises a plurality of interconnects and wherein the method further comprises bonding a first die to one of the plurality of interconnects and bonding a second die to another of the plurality of interconnects, the bonding the first die and the second die being accomplished using thermo-compression based bonding.

18. The method of claim 14 , wherein the organic bridge is bonded into a single buildup layer of the organic package substrate.

Assignees

• Intel Corp

Inventors

• Roy Mihir K
• Lotz Stephanie M
• Jen Wei-Lun Kane

Classifications

• H10W70/618

  the bridge chips being embedded in the package substrates, interposers or redistribution layers · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/07232

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title