Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Semiconductor light emitting device and method of manufacturing the same
US9236304B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9236304-B2 |
| Application number | US-201414150713-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 8, 2014 |
| Priority date | Jan 15, 2013 |
| Publication date | Jan 12, 2016 |
| Grant date | Jan 12, 2016 |
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Abstract
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A method of manufacturing a semiconductor light emitting device includes forming a plurality of semiconductor light emitting devices on a substrate, the semiconductor light emitting devices having at least one electrode pad formed on upper surfaces thereof; forming a conductive bump by forming a bump core on the electrode pad of each of the semiconductor light emitting devices and forming a reflective bump layer enclosing the bump core; forming a resin encapsulating part containing a phosphor on the plurality of semiconductor light emitting devices to encompass the conductive bump; polishing the resin encapsulating part to expose the bump core of the conductive bump to an upper surface of the resin encapsulating part; and forming individual semiconductor light emitting devices by cutting the resin encapsulating part between the semiconductor light emitting devices.
First claim
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What is claimed is: 1. A method of manufacturing a semiconductor light emitting device, the method comprising: forming a plurality of semiconductor light emitting devices on a substrate, the semiconductor light emitting devices having at least one electrode pad formed on upper surfaces thereof; forming a conductive bump by forming a bump core on the electrode pad of each of the semiconductor light emitting devices and forming a reflective bump layer enclosing the bump core; fo…
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- What does patent US9236304B2 cover?
- A method of manufacturing a semiconductor light emitting device includes forming a plurality of semiconductor light emitting devices on a substrate, the semiconductor light emitting devices having at least one electrode pad formed on upper surfaces thereof; forming a conductive bump by forming a bump core on the electrode pad of each of the semiconductor light emitting devices and forming a ref…
- Who is the assignee on this patent?
- Samsung Electronics Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W70/60. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).