Magnetic trap for cylindrical diamagnetic materials

Patent metadata

Field	Value
Publication number	US-9236293-B2
Application number	US-201514743051-A
Country	US
Kind code	B2
Filing date	Jun 18, 2015
Priority date	Mar 13, 2013
Publication date	Jan 12, 2016
Grant date	Jan 12, 2016

Abstract

A system for self-aligning diamagnetic materials includes first and second magnets contacting each other along a contact line and having a diametric magnetization perpendicular to the contact line and a diamagnetic rod positioned to levitate above the contact line of the first and second magnets.

First claim

What is claimed is:

1. A method of arranging a diamagnetic rod comprising:
levitating a diamagnetic rod above a contact line at which a first magnet contacts a second magnet, the first magnet and the second magnet having diametric magnetization in a direction perpendicular to the contact line;
positioning the diamagnetic rod being levitated above the contact line against a target substrate to form wiring on the target substrate, wherein the first magnet and the second magnet make up one magnetic trap among an array of magnetic traps mounted on a template substrate;
depositing a plurality of diamagnetic rods onto the array of magnetic traps;
capturing, by the array of magnetic traps, a number of captured diamagnetic rods, among the plurality of diamagnetic rods, corresponding to a number of magnetic traps in the array of magnetic traps;
oscillating the trapped diamagnetic rods along the longitudinal axis to measure a magnetic susceptibility of the trapped diamagnetic rods; and
determining the magnetic susceptibility of the trapped diamagnetic rods based on a magnetic field due to a single cylindrical diametric.

2. The method of claim 1 , further comprising:
cleaning the template substrate to remove from the template substrate any un-captured diamagnetic rods among the plurality of diamagnetic rods.

3. The method of claim 2 , further comprising:
bringing the captured diamagnetic rods into contact with a target substrate to form wiring on the target substrate.

Assignees

• IBM

Inventors

• Cao Qing
• Gunawan Oki

Classifications

• H10P74/20

  characterised by the properties tested or measured, e.g. structural or electrical properties · CPC title

• H10P14/40

  of conductive or resistive materials · CPC title

• H10W20/0554

  of nanotubes or nanowires · CPC title

• H10W20/4462

  Carbon or carbon-containing materials, e.g. graphene · CPC title

• H10W20/069

  by forming self-aligned vias or self-aligned contact plugs · CPC title