Semiconductor device
US-2024421048-A1 · Dec 19, 2024 · US
Core-jacket bonding wire
US9236166B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9236166-B2 |
| Application number | US-201113811419-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 18, 2011 |
| Priority date | Jul 22, 2010 |
| Publication date | Jan 12, 2016 |
| Grant date | Jan 12, 2016 |
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- Title
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Abstract
Official abstract text for this publication.
A bonding wire is provided containing a wire core made of a first material containing a metal and a wire jacket that envelopes the wire core and is made of a second material containing a metal. The wire core and the wire jacket are made of different metals and the bonding wire has an aspect ratio of no more than 0.8. The bonding wire efficiently prevents damage to bonding surfaces during the bonding process and short-circuiting during the use of corresponding sub-assemblies.
First claim
Opening claim text (preview).
We claim: 1. A bonding wire comprising a wire core and a wire jacket fully enveloping the wire core, wherein the wire core comprises a first material selected from the group consisting of copper, copper alloys, and inter-metallic phases containing copper, and the wire jacket comprises a second material selected from the group consisting of aluminum, aluminum alloys, and inter-metallic phases containing aluminum, wherein the bonding wire has an aspect ratio of no more than 0.8, a th…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9236166B2 cover?
- A bonding wire is provided containing a wire core made of a first material containing a metal and a wire jacket that envelopes the wire core and is made of a second material containing a metal. The wire core and the wire jacket are made of different metals and the bonding wire has an aspect ratio of no more than 0.8. The bonding wire efficiently prevents damage to bonding surfaces during the bo…
- Who is the assignee on this patent?
- Milke Eugen, Dick Jürgen, Prenosil Peter, and 3 more
- What technology area does this patent fall under?
- Primary CPC classification H10W72/50. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jan 12 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).