Light emission detection device having a flow path formed by a depression of a detection side substrate and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-9234791-B2
Application number	US-201213983754-A
Country	US
Kind code	B2
Filing date	Jan 25, 2012
Priority date	Feb 7, 2011
Publication date	Jan 12, 2016
Grant date	Jan 12, 2016

Abstract

A light emission detection device having a flow path from which light to be detected is emitted is provided. The device includes a detection-side substrate having a joining surface and a detection surface provided opposite the joining surface, the joining surface having a depression and a light-shielding film provided over an area excluding the depression, the depression forming the flow path, the detection surface transmitting the light emitted from the flow path; and a wiring-side substrate having a joining surface and a conductive pattern provided with a varying thickness on the joining surface, the joining surface of the wiring-side substrate joining the joining surface of the detection-side substrate. In the area over which the light-shielding film is provided, adhesive is provided with a thickness corresponding to the varying thickness of the conductive pattern and the detection-side substrate and the wiring-side substrate are closely joined to each other with the adhesive.

First claim

The invention claimed is:

1. A light emission detection device having a flow path from which light to be detected is emitted, the device comprising:
a detection-side substrate having a joining surface and a detection surface provided opposite the joining surface, the joining surface having a depression and a light-shielding film provided over an area excluding the depression, the depression forming the flow path, the detection surface transmitting the light emitted from the flow path; and
a wiring-side substrate having a joining surface and a conductive pattern provided with a varying thickness on the joining surface, the joining surface of the wiring-side substrate joining the joining surface of the detection-side substrate,
wherein, in the area over which the light-shielding film is provided, adhesive is provided with a thickness corresponding to the varying thickness of the conductive pattern and the detection-side substrate and the wiring-side substrate are joined to each other with the adhesive.

2. The light emission detection device according to claim 1 , wherein a heater member is provided in an area of the wiring-side substrate that defines the flow path.

3. The light emission detection device according to claim 2 , wherein a longitudinal direction of the heater member corresponds to a direction in which the flow path extends.

4. The light emission detection device according to claim 1 , wherein, at least in the area in which the adhesive is provided, an insulating film is provided over the conductive pattern.

5. The light emission detection device according to claim 1 , wherein the light emission detection device is provided with an interface module including connection portions connected to an inlet and an outlet of the flow path of the light emission detection device, flow paths connected to the respective connection portions, and openings communicating with the respective flow paths of the interface module, the interface module being joined at the connection portions thereof to the light emission detection device with adhesive.

6. The light emission detection device according to claim 5 , wherein areas of the light emission detection device over and around the inlet and the outlet of the flow path are free of the light-shielding film.

7. A method of manufacturing a light emission detection device, comprising:
forming a light-shielding film on a light-transmissive substrate;
patterning the light-shielding film on the substrate in such a manner as to correspond to a flow path pattern;
etching the substrate by using the light-shielding film as a mask such that a surface of the substrate comes to have a depression while an area excluding the depression remains covered with the light-shielding film;
applying adhesive onto the area of the substrate excluding the depression; and
joining the substrate to a wiring-side substrate with the adhesive, the wiring-side substrate having a conductive pattern provided thereon with a varying thickness.

8. The method of manufacturing a light emission detection device according to claim 7 , wherein the light-shielding film is a chromium metal film, and the light-transmissive substrate is made of an inorganic glass material.

9. The method of manufacturing a light emission detection device according to claim 8 ,
wherein the etching is performed in a wet manner, and
wherein the method further comprises removing part of the chromium metal film projecting over the depression by applying ultrasonic waves after the etching.

Assignees

• Ogusu Makoto
• Canon Kk

Inventors

• Ogusu Makoto

Classifications

• B01L3/502707 Primary

  characterised by the manufacture of the container or its components · CPC title

• B29D11/00

  Producing optical elements, e.g. lenses or prisms (grinding or polishing of optical elements B24B; constructional form of optical elements G02B; {optical parts of spectacles G02C7/00}) · CPC title

• G01J1/42 Primary

  using electric radiation detectors (optical or mechanical part G01J1/04; by comparison with a reference light or electric value G01J1/10) · CPC title

• G01N2021/0346

  Capillary cells; Microcells · CPC title

• G01N21/0332

  with temperature control (control of temperature G05D23/00; cryostats F17C3/08) · CPC title