Heat exchanger with subcooling circuit

Patent metadata

Field	Value
Publication number	US-9234673-B2
Application number	US-201113276000-A
Country	US
Kind code	B2
Filing date	Oct 18, 2011
Priority date	Oct 18, 2011
Publication date	Jan 12, 2016
Grant date	Jan 12, 2016

Abstract

An air handling unit has a blower configured to selectively move air from an air inlet of the air handling unit to an air outlet of the air handling unit along an airflow direction extending from the blower to the air outlet, a heat exchanger disposed within the air handling unit between the inlet and the outlet, the heat exchanger has a thermal conductor, an evaporator tube thermally conductively joined to the thermal conductor, and a subcooler tube thermally conductively joined to the thermal conductor. An expansion device provides fluid communication between the evaporator tube and the subcooler tube and a drain pan disposed within the air handling unit upstream relative to the at least one subcooler tube and positioned in a geometrical footprint of at least a portion of the drain pan as the drain pan is viewed from an upstream position in the airflow direction.

First claim

The invention claimed is:

1. An air handling unit, comprising:
a blower configured to selectively move air from an air inlet of the air handling unit to an air outlet of the air handling unit along an airflow direction extending from the blower to the air outlet;
a heat exchanger comprising a first slab and a second slab, each slab comprising an upper end and a lower end and disposed within the air handling unit between the air inlet and the air outlet such that the upper end is located nearer the air outlet than the lower end, and each slab of the heat exchanger further comprising:
at least one thermally conductive fin;
an evaporator circuit comprising at least one evaporator tube (1) comprising an evaporator tube inlet and an evaporator tube outlet and (2) disposed through and thermally conductively joined to the at least one thermally conductive fin at the upper end of the heat exchanger; and
a subcooler circuit comprising;
a first subcooler tube comprising a subcooler tube inlet; and
a second subcooler tube joined to the first subcooler tube by a hairpin joint, the second subcooler tube comprising a subcooler tube outlet, wherein each of the first subcooler tube and the second subcooler tube are disposed through and thermally conductively joined to the at least one thermally conductive fin at the lower end of the heat exchanger;

a subcooler crossover tube that delivers refrigerant from the subcooler tube outlet of the second subcooler tube of the first slab to the subcooler tube inlet of the first subcooler tube of the second slab;
an expansion device providing fluid communication between the evaporator tube inlet of the at least one evaporator tube of the evaporator circuit of each of the first slab and the second slab and the subcooler tube outlet of the second subcooler tube of the subcooler circuit of the second slab, wherein the expansion device comprises only one inlet and the inlet is connected in fluid communication with the subcooler tube outlet of the second subcooler tube of the subcooler circuit of the second slab; and
a drain pan disposed within the air handling unit upstream relative to the heat exchanger, wherein the first subcooler tube and the second subcooler tube of the subcooler circuit of each of the first slab and the second slab is positioned in a geometrical footprint of the drain pan as the drain pan is viewed from an upstream position in the primary airflow direction.

2. The air handling unit of claim 1 , wherein the drain pan comprises a concavity configured to receive condensate from the heat exchanger when the concavity is generally open in a vertically upward direction.

3. The air handling unit of claim 2 , wherein (1) at least a portion of at least one of the first subcooler tube and the second subcooler tube and (2) at least a portion of the thermally conductive fin are received within the concavity.

4. The air handling unit of claim 1 , wherein the first slab and the second slab are configured in a substantially A-shaped arrangement.

5. The air handling unit of claim 1 , wherein in each slab all evaporator tubes are located downstream relative to the first subcooler tube and the second subcooler tube.

6. The air handling unit of claim 5 , further comprising; a housing in a surrounding relationship to the heat exchanger, wherein the drain pan is secured to the housing and the drain pan provides support for the heat exchanger.

7. The air handling unit of claim 1 , wherein the drain pan is configured to prevent air from the blower from reaching at least one of the first subcooler tube and the second subcooler tube of the subcooler circuit of each of the first slab and the second slab in a substantially straight path from the blower to the subcooler tubes as a result of at least one subcooler tube of the subcooler circuit of each of the first slab and the second slab being positioned in the geometrical footprint of the drain pan.

8. An HVAC system, comprising:
a heat exchanger comprising:
a first slab; and
a second slab;
wherein each of the first slab and the second slab comprise:
at least one thermally conductive fin;
an evaporator circuit comprising at least one evaporator tube (1) comprising an evaporator tube inlet and an evaporator tube outlet and (2) disposed through and thermally conductively joined to the at least one thermally conductive fin at an upper end of the heat exchanger; and
a subcooler circuit comprising
a first subcooler tube comprising a subcooler tube inlet; and
a second subcooler tube joined to the first subcooler tube by a hairpin joint, the second subcooler tube comprising a subcooler tube outlet wherein each of the first subcooler tube and the second subcooler tube are disposed through and thermally conductively joined to the at least one thermally conductive fin at a lower end of the heat exchanger;

a subcooler crossover tube that delivers refrigerant from the subcooler tube outlet of the second subcooler tube of the first slab to the subcooler tube inlet of the first subcooler tube of the second slab;
an expansion device providing fluid communication between the evaporator tube inlet of the at least one evaporator tube of the evaporator circuit of each of the first slab and the second slab and the subcooler tube outlet of the second subcooler tube of the subcooler circuit of the second slab, wherein the expansion device comprises only one inlet and the inlet is connected in fluid communication with the subcooler tube outlet of the second subcooler tube of the subcooler circuit of the second slab; and
a drain pan comprising a concavity configured to receive condensate from the heat exchanger when the concavity is generally open in a vertically upward direction;
wherein at least a portion of at least one of the first subcooler tube and the second subcooler tube of the subcooler circuit of each of the first slab and the second slab and the thermally conductive fin are received within the concavity.

9. The HVAC system of claim 8 , wherein the first slab and the second slab of the heat exchanger are configured in a substantially A-shaped arrangement.

10. The HVAC system of claim 9 , further comprising a housing in a surrounding relationship to the heat exchanger, wherein the drain pan is secured to the housing and the drain pan provides support for the heat exchanger.

11. The HVAC system of claim 8 , wherein the drain pan is configured to prevent air from the blower from reaching at least one of the first subcooler tube and the second subcooler tube of the subcooler circuit of each of the first slab and the second slab in a substantially straight path from the blower to the subcooler tubes as a result of at least one subcooler tube of the subcooler circuit of each of the first slab and the second slab being positioned in the concavity of the drain pan.

12. A method of assembling an air handling unit, comprising:
providing a heat exchanger, the heat exchanger comprising:
a first slab; and
a second slab, each of the first slab and the second slab comprising:
at least one thermally conductive fin;
an evaporator circuit comprising at least one evaporator tube (1) comprising an evaporator tube inlet and an evaporator tube outlet and (2) disposed through and thermally conductively joined to the at least one thermally conductive fin at an upper end of the heat exchanger;
a subcooler circuit comprising
a first subcooler tube (1) comprising a subcooler tube inlet; and
a second subcooler tube joined to the first subcooler tube by a hairpin joint, the second subcooler tube comprising a subcooler tube outlet disposed through and thermally conductively joined to the at least one thermally conductive fin

Assignees

• Douglas Jonathan David
• Mercer Kevin B
• Harris Jr Benton A
• Hancock Stephen S
• Trane Int Inc

Inventors

• Douglas Jonathan David
• Mercer Kevin B
• Harris Jr Benton A
• Hancock Stephen S

Classifications

• Y10T29/4935

  Heat exchanger or boiler making · CPC title

• F24F13/222 Primary

  for evacuating condensate · CPC title

• F24F1/0007

  Indoor units, e.g. fan coil units (self-contained units F24F1/02) · CPC title

• F24F1/0063

  by the mounting or arrangement of the heat exchangers · CPC title