LED lamp

Patent metadata

Field	Value
Publication number	US-9234632-B2
Application number	US-201013202910-A
Country	US
Kind code	B2
Filing date	Feb 24, 2010
Priority date	Feb 25, 2009
Publication date	Jan 12, 2016
Grant date	Jan 12, 2016

Abstract

An LED lamp A includes a plurality of LED modules 2 each including an LED chip 21 , and a support member 1 including a support surface 1 a on which the LED modules 2 are mounted. The LED modules 2 include a plurality of kinds of LED modules, or a first through a third LED modules 2 A, 2 B and 2 C different from each other in directivity characteristics that represent light intensity distribution with respect to light emission directions. This arrangement ensures that the entire surrounding area can be illuminated with sufficient brightness.

First claim

The invention claimed is:

1. An LED lamp comprising:
a plurality of LED modules each including an LED chip;
a support member including a single flat support surface and a rear surface opposite to the single flat support surface, the LED modules being directly mounted on the single flat support surface; and
a heat dissipation member held in contact with the rear surface of the support member;
wherein the LED modules comprise a plurality of kinds of LED modules different from each other in directivity characteristics that represent light intensity distribution with respect to light emission directions,
the plurality of kinds of LED modules are mounted on the single flat support surface,
the plurality of kinds of LED modules include respective light-emitting surfaces facing in a same direction perpendicular to the single flat support surface,
the plurality of kinds of LED modules include a first LED module arranged adjacent to a center of the single flat support surface,
the directivity characteristics of the first LED module are such that light intensity in a normal direction of the single flat support surface is relatively high, as compared with the LED modules not adjacent to the center of the single flat support surface,
the plurality of LED modules include a second LED module arranged adjacent to an edge of the single flat support surface; and
the directivity characteristics of the second LED module are such that light intensity in an outward direction within a plane of the single flat support surface is relatively high, as compared with LED modules not adjacent to the edge of the single flat support surface,
the light emitting surfaces of the first LED module and the light emitting surfaces of the second LED module are parallel to the plane of the single flat support surface, and
the light intensity of the first LED module in the direction perpendicular to the single flat support surface is greater than the light intensity of the second LED module in the direction perpendicular to the single flat support surface.

2. The LED lamp according to claim 1 , wherein the first LED module includes a reflector that surrounds the LED chip and that is open in the normal direction.

3. The LED lamp according to claim 2 , wherein: the first LED module further includes a sealing resin that seals the LED chip; and
the sealing resin is filled in a space surrounded by the reflector.

4. The LED lamp according to claim 3 , wherein a dimension of the first LED module in the normal direction of the single flat support surface of the support member is smaller than a dimension of the first LED module in an in-plane direction of the single flat support surface.

5. The LED lamp according to claim 4 , wherein: the first LED module includes a substrate on which the LED chip is mounted; and
the substrate is provided with a mount terminal on a surface thereof opposite from a surface on which the LED chip is mounted.

6. The LED lamp according to claim 1 , wherein the second LED module includes a reflector that surrounds the LED chip and that is open in the outward direction within the plane of the single flat support surface.

7. The LED lamp according to claim 6 , wherein the second LED module further includes a sealing resin that seals the LED chip; and
the sealing resin is filled in a space surrounded by the reflector.

8. The LED lamp according to claim 7 , wherein the second LED module includes a substrate on which the LED chip is mounted; and the second LED module is mounted on the support member, with a side surface of the substrate facing the single flat support surface of the support member.

9. The LED lamp according to claim 8 , wherein a dimension of the second LED module in an in-plane direction of the support member is larger than a dimension of the second LED module in the normal direction of the support member.

10. The LED lamp according to claim 1 , wherein the plurality of LED modules further include a third LED module arranged between the first LED module and the second LED module, the directivity characteristics of the third LED module being such that the light intensity distribution with respect to the light emission direction is relatively uniform, as compared with the first and the second LED modules.

11. The LED lamp according to claim 10 , wherein: the third LED module includes a substrate on which the LED chip is mounted; and
the substrate is provided with a mount terminal on a surface thereof opposite from a surface on which the LED chip is mounted.

12. The LED lamp according to claim 11 , wherein: the third LED module includes a sealing resin that seals the LED chip; and
the sealing resin is exposed in both of the normal direction of the single flat support surface and the in-plane direction of the single flat support surface.

13. The LED lamp according to claim 10 , wherein:
the single flat support surface has an elongated shape;
a plurality of said first LED modules are arranged in a longitudinal direction of the single flat support surface adjacent to a center of the single flat support surface;
a plurality of said second LED modules are arranged along edges of the single flat support surface that are spaced from each other in a width direction; and
a plurality of said third LED modules are arranged in the longitudinal direction at each of regions between the first LED modules and the second LED modules.

14. The LED lamp according to claim 13 , further comprising a case that accommodates the first through the third LED modules and the support member and allows light emitted from the first through the third LED modules to pass through while diffusing the light.

15. The LED lamp according to claim 14 , wherein the case is cylindrical, and the single flat support surface of the support member is spaced apart from a center axis of the case.

16. The LED lamp according to claim 15 , wherein the support member is an insulating substrate.

17. The LED lamp according to claim 16 , wherein the case is formed with a projecting piece that projects inward and supports the substrate.

18. The LED lamp according to claim 17 , wherein the projecting piece is in engagement with the heat dissipation member.

Assignees

• Kawabata Yusaku
• Rohm Co Ltd

Inventors

• Kawabata Yusaku

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title

• H10H20/855

  Optical field-shaping means, e.g. lenses · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title

• H10H20/856

  Reflecting means · CPC title