Microfluidic chips and methods of producing microfluidic chips
US-2024351025-A1 · Oct 24, 2024 · US
US9233369B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9233369-B2 |
| Application number | US-201113336717-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 23, 2011 |
| Priority date | Dec 23, 2010 |
| Publication date | Jan 12, 2016 |
| Grant date | Jan 12, 2016 |
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Official abstract text for this publication.
A method of fabricating a fluidic device comprises providing a fluidic device including a body having a surface and one or more channels located in the body. Recesses are defined on said surface. The one or more channels can have respective boundaries. A layer of adhesive including one or more panel-shaped pieces having a pattern based on the pattern of boundaries of the channels can be formed and applied on the surface of the body. It is further controlled that the layer of adhesive has respective boundaries surrounding the boundaries of the one or more channels.
Opening claim text (preview).
The invention claimed is: 1. A method of fabricating a fluidic device, the method comprising: providing a fluidic device including a body having a surface and one or more channels located in the body and defining recesses on said surface, the one or more channels having respective boundaries, wherein the one or more channels are continuously open to the surface; providing the body with protruding walls that protrude from said surface and continuously surround the one or more channels at the boundaries of the one or more channels; forming a layer of adhesive including one or more panel-shaped pieces having a pattern based on a pattern of the boundaries of the one or more channels; and applying the layer of adhesive on the surface by using a known amount of adhesive, and controlling that the layer of adhesive has respective boundaries surrounding the boundaries of the one or more channels by applying pressure in a controlled manner to form a uniformly applied adhesive layer, wherein the protruding walls separate the layer of adhesive from the one or more channels. 2. The method of claim 1 , wherein the controlling the layer of adhesive has respective boundaries surrounding the boundaries of the one or more channels is controlling an offset defined among the boundaries of the layer of adhesive and the boundaries of the one or more channels. 3. The method of claim 1 , wherein the surface comprises depressed regions which accommodate the layer of adhesive and define said protrusions, said protrusions being able to avoid contact between the layer of adhesive and fluid passing through the one or more channels. 4. The method of claim 1 , wherein the layer of adhesive is formed in such a manner that a small offset is left between the boundaries of the channels and the boundaries of the layer of adhesive. 5. The method of claim 1 , wherein the layer of adhesive is applied only on selective zones of the surface and defines thermal guards for a fluid passing through the one or more channels. 6. The method of claim 1 , wherein different layers of adhesive are applied on the surface.
Surface properties and coatings · CPC title
Configuration of multiple channels and/or chambers in a single devices · CPC title
Specific details about manufacturing devices · CPC title
Laminated structure · CPC title
Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept · CPC title
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