Molybdenum compound powder, prepreg, and laminate

Patent metadata

Field	Value
Publication number	US-9232648-B2
Application number	US-201214347075-A
Country	US
Kind code	B2
Filing date	Sep 12, 2012
Priority date	Sep 26, 2011
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

The present invention provides a novel surface-treated molybdenum compound powder and provides a prepreg, a laminate, a metal foil laminate, a printed wiring board, and the like that have a low thermal expansion coefficient in the planar direction, and excellent drillability, heat resistance, and flame retardancy. The surface-treated molybdenum compound powder of the present invention has at least part of the surface thereof coated with an inorganic oxide, and this is used as a filler.

First claim

The invention claimed is:

1. A surface-treated molybdenum compound powder having at least part of a surface thereof coated with an inorganic oxide, wherein the inorganic oxide is at least one selected from the group consisting of SiO 2 , Al2O 3 , TiO 2 , ZnO, In 2 O 3 , SnO 2 , NiO, CoO, V 2 O 5 , CuO, MgO, and ZrO 2 .

2. The surface-treated molybdenum compound powder according to claim 1 , comprising:
a core particle comprising a molybdenum compound; and
the inorganic oxide formed on at least part of a surface of the core particle.

3. The surface-treated molybdenum compound powder according to claim 1 , wherein the molybdenum compound is at least one selected from the group consisting of zinc molybdate, molybdenum trioxide, ammonium molybdate, and a molybdenum hydrate.

4. The surface-treated molybdenum compound powder according to claim 1 , wherein the inorganic oxide is at least one selected from the group consisting of silica, titania, alumina, and zirconia.

5. The surface-treated molybdenum compound powder according to claim 1 , wherein the inorganic oxide has a thickness of 3 to 500 nm.

6. The surface-treated molybdenum compound powder according to claim 2 , wherein the core particle has an average particle diameter of 0.1 to 30 μm.

7. A filler comprising the surface-treated molybdenum compound powder according to claim 1 .

8. A resin composition comprising the surface-treated molybdenum compound powder according to claim 1 (A), an epoxy resin (B), a curing agent (C), and an inorganic filler (D).

9. The resin composition according to claim 8 , wherein a content of the surface-treated molybdenum compound powder (A) is 0.2 to 30 parts by mass based on 100 parts by mass of a total of resin solid components.

10. The resin composition according to claim 8 , wherein the curing agent (C) is at least one selected from the group consisting of a cyanate ester compound, a phenolic resin, and a BT resin.

11. The resin composition according to claim 10 , wherein the cyanate ester compound is a naphthol aralkyl-based cyanate ester compound represented by the following general formula (8) and/or a phenol novolac-based cyanate ester compound represented by the following general formula (9):

wherein R 11 each independently represents a hydrogen atom or a methyl group, and q represents an integer of 1 or more;

wherein R 11 each independently represents a hydrogen atom or a methyl group, and q represents an integer of 1 or more.

12. The resin composition according to claim 10 , wherein the phenolic resin is at least one selected from the group consisting of a cresol novolac-based phenolic resin, an aminotriazine novolac-based phenolic resin, a naphthalene-based phenolic resin, a naphthol aralkyl-based phenolic resin represented by the following general formula (10), and a biphenyl aralkyl-based phenolic resin represented by the following general formula (11):

wherein R 12 each independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 or more;

wherein R 12 each independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 or more.

13. The resin composition according to claim 12 , wherein the phenolic resin is a naphthol aralkyl-based phenolic resin represented by the following general formula (10) and/or a biphenyl aralkyl-based phenolic resin represented by the following general formula (11):

wherein R 12 each independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 or more;

wherein R 12 each independently represents a hydrogen atom or a methyl group, and n represents an integer of 1 or more.

14. The resin composition according to claim 8 , wherein the epoxy resin (B) is an epoxy resin represented by the following general formula (1) and/or the following general formula (3a):

wherein Ar 1 and Ar 2 each independently represent an aryl group which is a substituent derived from a monocyclic or polycyclic aromatic hydrocarbon that is a phenyl group, a naphthyl group, or a biphenyl group, R a each independently represents a hydrogen atom or a methyl group, R x and R y each independently represent a hydrogen atom, an alkyl group, or an aryl group, m represents an integer of 1 to 5, n represents an integer of 1 to 50, and G represents a glycidyl group;

wherein R 1 each independently represents a hydrogen atom or a methyl group, Ar 3 and Ar 4 each independently represent a naphthylene group or a phenylene group, both groups may each have an alkyl group having 1 to 4 carbon atoms or a phenylene group as a substituent, R 2 each independently represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an aralkyl group represented by the following general formula (4), m and n are each independently an integer of 0 to 4 provided that either one of m and n is 1 or more, R 3 each independently represents a hydrogen atom, an aralkyl group represented by the following general formula (4), or an epoxy group-containing aromatic hydrocarbon group represented by the following general formula (5), where in the above general formula (3a), a bonding position to a naphthalene structure part may be either of two benzene rings constituting the naphthalene structure part;

wherein R 4 and R 5 each independently represent a hydrogen atom or a methyl group, Ar 5 represents a phenylene group, a phenylene group or a naphthylene group in which 1 to 3 hydrogen atoms are each nucleus-replaced by an alkyl group having 1 to 4 carbon atoms, or a naphthylene group in which 1 to 3 hydrogen atoms are each nucleus-replaced by an alkyl group having 1 to 4 carbon atoms, and o is a number of 0.1 to 4 on average;

wherein R 6 represents a hydrogen atom or a methyl group, Ar 6 represents a naphthylene group or a naphthylene group having an alkyl group having 1 to 4 carbon atoms, an aralkyl group, or a phenylene group as a substituent, and p is an integer of 1 or 2.

15. The resin composition according to claim 8 , further comprising a maleimide compound (E).

16. The resin composition according to claim 8 , wherein a content of the epoxy resin (B) is 5 to 60 parts by mass based on 100 parts by mass of the total of the resin solid components.

17. The resin composition according to claim 8 , wherein a content of the curing agent (C) is 10 to 70 parts by mass based on 100 parts by mass of the total of the resin solid components.

18. A prepreg obtained by impregnating or coating a substrate wit

Assignees

• Miyahira Tetsuro
• Kato Yoshihiro
• Ogashiwa Takaaki
• Takahashi Hiroshi
• Mitsubishi Gas Chemical Co

Inventors

• Miyahira Tetsuro
• Kato Yoshihiro
• Ogashiwa Takaaki
• Takahashi Hiroshi

Classifications

• C01P2004/61

  Micrometer sized, i.e. from 1-100 micrometer · CPC title

• C08K9/02

  Ingredients treated with inorganic substances · CPC title

• C01P2004/62

  Submicrometer sized, i.e. from 0.1-1 micrometer · CPC title

• B32B27/20

  using fillers, pigments, thixotroping agents · CPC title

• C01G39/00

  Compounds of molybdenum · CPC title