Thermal isolation in printed circuit board assemblies

Patent metadata

Field	Value
Publication number	US-9232640-B2
Application number	US-201313792092-A
Country	US
Kind code	B2
Filing date	Mar 10, 2013
Priority date	Mar 10, 2013
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

A printed circuit board assembly for reducing the impact of heat generated from circuitry within a handheld or non-handheld device is provided. The printed circuit board assembly may include a printed circuit board comprising a plurality of conductive layers and a plurality of dielectric layers where each dielectric layer is disposed between a pair of conductive layers. Each conductive layer may include a first portion and a second portion separated by a gap where the gaps in the alternating conductive layers are misaligned. The first portion of each conductive layer may be substantially thermally isolated from the second portion of each conductive layer.

First claim

The invention claimed is:

1. A printed circuit board assembly comprising:
a printed circuit board, the printed circuit board comprising:
a plurality of conductive layers where each conductive layer in the plurality of conductive layers includes a first portion and a second portion separated by a gap, where first portions of the conductive layers form a first functional area and second portions of the conductive layers form a second functional area, and where at least one conductive layer is a ground plane;
a plurality of dielectric layers, each dielectric layer of the plurality of dielectric layers disposed between a pair of conductive layers in the plurality of conductive layers; and
a plurality of RF capacitors connected to the ground plane allowing signals at RF frequencies to pass through the plurality of RF capacitors maintaining continuity of the ground plane, the plurality of RF capacitors extending from the first functional area to the second functional area across the gap,

wherein gaps in alternating conductive layers are misaligned.

2. The printed circuit board assembly of claim 1 , wherein the first portion is shorter than the second portion.

3. The printed circuit board assembly of claim 1 , wherein the first portion is substantially thermally isolated from the second portion.

4. The printed circuit board assembly of claim 1 , wherein lengths of at least some first portions of the plurality of conductive layers are the same.

5. The printed circuit board assembly of claim 1 , further comprising a wireless communication module, integrally connected to and in communication with the second functional area of the printed circuit board, adapted to establish a wireless communication link with an external device, the wireless communication module having an antenna assembly for transmitting and/or receiving data.

6. The printed circuit board assembly of claim 5 , further comprising a data collection module integrally connected to and in communication with the printed circuit board.

7. The printed circuit board assembly of claim 6 , wherein the data collection module is a blood glucose module configured to measure a blood glucose level.

8. The printed circuit board assembly of claim 1 , further comprising a metal trace connected to the ground plane creating a DC connection.

9. The printed circuit board assembly of claim 1 , wherein the misaligned gaps form a curvature pattern.

10. The printed circuit board assembly of claim 1 , wherein the misaligned gaps form a pattern of integrally connected straight segments.

11. A method of manufacturing a printed circuit board assembly, comprising:
providing a printed circuit board;
providing a plurality of conductive layers on the printed circuit board, each conductive layer having a first portion and a second portion separated by a gap where gaps in alternating conductive layers are misaligned, where first portions of the conductive layers form a first functional area and second portions of the conductive layers form a second functional area, and where at least one conductive layer is a ground plane;
providing a plurality of dielectric layers on the printed circuit board, each dielectric layer of the plurality of dielectric layers disposed between a pair of conductive layers in the plurality of conductive layers; and
providing a plurality of RF capacitors connected to the ground plane allowing signals at RF frequencies to pass through the plurality of RF capacitors maintaining continuity of the ground plane, where the plurality of RF capacitors extend from the first functional area to the second functional area across the gap.

12. The method of claim 11 , wherein the first portion is shorter than the second portion.

13. The method of claim 11 , wherein the first portion is substantially thermally isolated from the second portion.

14. The method of claim 11 , wherein lengths of at least some first portions of the plurality of conductive layers are the same.

15. The method of claim 11 , further comprising providing a wireless communication module, integrally connected to and in communication with the second functional area of the printed circuit board, adapted to establish a wireless communication link with an external device, the wireless communication module having an antenna assembly for transmitting and/or receiving data.

16. The method of claim 15 , further comprising providing a data collection module integrally connected to and in communication with the printed circuit board.

17. The method of claim 16 , wherein the data collection module is a blood glucose module configured to measure a blood glucose level.

18. The method of claim 11 , further comprising providing a metal trace connected to the ground plane creating a DC connection.

19. The method of claim 11 , wherein the misaligned gaps form a curvature pattern.

20. The method of claim 11 , wherein the misaligned gaps form a pattern of integrally connected straight segments.

21. A printed circuit board assembly comprising:
a printed circuit board, the printed circuit board comprising:
a plurality of conductive means where each conductive means in the plurality of conductive means includes a first portion and a second portion separated by a gap, where first portions of the conductive means form a first functional area and second portions of the conductive means form a second functional area, and where at least one conductive layer is a ground plane;
a plurality of dielectric means, each dielectric means of the plurality of dielectric means disposed between a pair of conductive means in the plurality of conductive means; and
a plurality of RF capacitors connected to the ground plane allowing signals at RF frequencies to pass through the plurality of RF capacitors maintaining continuity of the ground plane, the plurality of RF capacitors extending from the first functional area to the second functional area across the gap,

wherein gaps in alternating conductive layers are misaligned.

22. The printed circuit board assembly of claim 21 , wherein the first portion is shorter than the second portion.

23. The printed circuit board assembly of claim 21 , wherein the first portion is substantially thermally isolated from the second portion.

24. The printed circuit board assembly of claim 21 , lengths of at least some first portions of the plurality of conductive layers are the same.

25. The printed circuit board assembly of claim 21 , further a wireless means communication, integrally connected to and in communication with the printed circuit board, adapted to establish a wireless communication link with an external device.

26. The printed circuit board assembly of claim 25 , further comprising a data collection means integrally connected to and in communication with the printed circuit board.

27. The printed circuit board assembly of claim 26 , wherein the data collection means is a blood glucose module configured to measure a blood glucose level.

28. The printed circuit board assembly of claim 21 , further comprising:
an antenna assembly; and
a first functional area and a second functional area connected to the ground plane.

29. The printed circuit board assembly of claim 28 , further comprising a metal trace connected to the ground plane creating a DC connection.

30. The printed circuit board assembly of clai

Assignees

• Qualcomm Inc

Inventors

• Zhang Yang
• Steenstra Jack B

Classifications

• H05K2201/10151

  Sensor · CPC title

• Y10T29/49124

  On flat or curved insulated base, e.g., printed circuit, etc. · CPC title

• H05K2201/09972

  Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently · CPC title

• H05K1/0201

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title

• H05K2201/10098

  Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas · CPC title