Flexible printed wiring board and laminate for production of flexible printed wiring board

Patent metadata

Field	Value
Publication number	US-9232636-B2
Application number	US-201113992189-A
Country	US
Kind code	B2
Filing date	Feb 18, 2011
Priority date	Dec 21, 2010
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

The flexible printed wiring board according to the present invention includes a first flexible insulating layer, a first conductor wiring laminated on the first insulating layer, a second single-layered insulating layer laminated on the first insulating layer, as it covers the first conductor wiring, and a second conductor wiring laminated on the second insulating layer. The first conductor wiring has a thickness in the range of 10 to 30 μm, a line width in the range of 50 μm to 1 mm, and a line gap in the range of 50 μm to 1 mm. The thickness from the surface of the first conductor wiring to the surface of the second insulating layer is in the range of 5 to 30 μm. The surface waviness of the part of the second insulating layer covering the first conductor wiring is 10 μm or less.

First claim

The invention claimed is:

1. A flexible printed wiring board, comprising
a first insulating layer that is flexible,
a first conductor wiring laminated on the first insulating layer,
a second insulating layer that is a single layer and laminated on the first insulating layer, as it covers the first conductor wiring, and
a second conductor wiring laminated on the second insulating layer, wherein:
the first conductor wiring has a thickness in the range of 10 to 30 μm, a line width in the range of 50 μm to 1 mm, and a line gap in the range of 50 μm to 1 mm;
a thickness from a surface of the first conductor wiring to a surface of the second insulating layer is in the range of 5 to 30 μm;
a surface waviness of part of the second insulating layer covering the first conductor wiring is 10 μm or less;
the second insulating layer is made of a hardened product of an epoxy resin composition containing an epoxy resin, a curing agent, and a carbodiimide-modified soluble polyamide; and
the epoxy resin contains a naphthalene skeleton-containing epoxy resin.

2. A flexible printed wiring board, comprising
a first insulating layer that is flexible,
a first conductor wiring laminated on the first insulating layer,
a second insulating layer that is laminated on the first insulating layer, as it covers the first conductor wiring, and
a second conductor wiring laminated on the second insulating layer, wherein:
the second insulating layer includes a third insulating layer directly laminated on the first insulating layer and a fourth insulating layer laminated on the third insulating layer;
the first conductor wiring has a thickness in the range of 10 to 30 μm, a line width in the range of 50 μm to 1 mm, and a line gap in the range of 50 μm to 1 mm;
a thickness from a surface of the first conductor wiring to a surface of the third insulating layer, among the multiple layers constituting the second insulating layer, is in the range of 5 to 30 μm;
a surface waviness of part of the second insulating layer covering the first conductor wiring is 10 μm or less;
the third insulating layer is made of a hardened product of an epoxy resin composition containing an epoxy resin, a curing agent, and a carbodiimide-modified soluble polyamide; and
the epoxy resin contains a naphthalene skeleton-containing epoxy resin.

3. The flexible printed wiring board as set forth in claim 1 , wherein a content of the carbodiimide-modified soluble polyamide in the epoxy resin composition is in the range of 40 to 70 mass %.

4. The flexible printed wiring board as set forth in claim 1 , wherein the naphthalene skeleton-containing epoxy resin contains at least one compound selected from compounds represented by the following formulae (1) to (3):

5. The flexible printed wiring board as set forth in claim 1 , wherein the curing agent contains at least one of dicyandiamide and aminotriazine novolac resins represented by the following formula (4):

6. The flexible printed wiring board as set forth in claim 1 , wherein the carbodiimide-modified soluble polyamide contains a reaction product of 100 parts by mass of a soluble polyamide and 0.5 to 20 parts by mass of a carbodiimide compound.

7. The flexible printed wiring board as set forth in claim 1 , wherein the epoxy resin composition contains a phenoxy resin.

8. The flexible printed wiring board as set forth in claim 1 , wherein the epoxy resin composition contains at least one compound selected from phosphorus-modified epoxy resins, phosphorus-modified phenoxy resins, and phosphorus-based flame retardants.

9. The flexible printed wiring board as set forth in claim 1 , wherein a through hole is formed in the first insulating layer and part of the second insulating layer fills the through hole.

10. A laminate for production of a flexible printed wiring board comprising:
a first insulating layer that is flexible,
a first conductor wiring laminated on the first insulating layer,
a second insulating layer that is a single layer and laminated on the first insulating layer, as it covers the first conductor wiring, and
a metal foil laminated on the second insulating layer, wherein
the first conductor wiring has a thickness in the range of 10 to 30 μm, a line width in the range of 50 μm to 1 mm, and a line gap in the range of 50 μm to 1 mm;
a thickness from a surface of the first conductor wiring to a surface of the second insulating layer is in the range of 5 to 30 μm;
a surface waviness of part of the second insulating layer covering the first conductor wiring is 10 μm or less;
the second insulating layer is made of a hardened product of an epoxy resin composition containing an epoxy resin, a curing agent, and a carbodiimide-modified soluble polyamide; and
the epoxy resin contains a naphthalene skeleton-containing epoxy resin.

11. A laminate for production of a flexible printed wiring board comprising
a first insulating layer that is flexible,
a first conductor wiring laminated on the first insulating layer,
a second insulating layer that is laminated on the first insulating layer, as it covers the first conductor wiring, and
a metal foil laminated on the second insulating layer, wherein
the second insulating layer includes a third insulating layer directly laminated on the first insulating layer and a fourth insulating layer laminated on the third insulating layer;
the first conductor wiring has a thickness in the range of 10 to 30 μm, a line width in the range of 50 μm to 1 mm, and a line gap in the range of 50 μm to 1 mm;
a thickness from a surface of the first conductor wiring to a surface of the third insulating layer, among the multiple layers constituting the second insulating layer, is in the range of 5 to 30 μM;
a surface waviness of part of the second insulating layer covering the first conductor wiring is 10 μm or less;
the third insulating layer is made of a hardened product of an epoxy resin composition containing an epoxy resin, a curing agent, and a carbodiimide-modified soluble polyamide; and
the epoxy resin contains a naphthalene skeleton-containing epoxy resin.

12. The flexible printed wiring board as set forth in claim 2 , wherein a content of the carbodiimide-modified soluble polyamide in the epoxy resin composition is in the range of 40 to 70 mass %.

13. The flexible printed wiring board as set forth in claim 2 , wherein the naphthalene skeleton-containing epoxy resin contains at least one compound selected from compounds represented by the following formulae (1) to (3):

14. The flexible printed wiring board as set forth in claim 2 , wherein the curing agent contains at least one of dicyandiamide and aminotriazine novolac resins represented by the following formula (4):

15. The flexible printed wiring board as set forth in claim 2 , wherein the carbodiimide-modified soluble polyamide contains a reaction product of 100 parts by mass of a soluble polyamide and 0.5 to 20 parts by mass of a carbodiimide compound.

16. The flexible printed wiring board as set forth in claim 2 , wherein the epoxy resin composition contains a phenoxy resin.

17. The flexible printed wiring board as set forth in claim 2 , wherein the epoxy res

Assignees

• Ozeki Takayoshi
• Ishikawa Yohsuke
• Esaki Yoshiaki
• Fukusumi Hiroyuki
• Panasonic Ip Man Co Ltd

Inventors

• Ozeki Takayoshi
• Ishikawa Yohsuke
• Esaki Yoshiaki
• Fukusumi Hiroyuki

Classifications

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08G59/54 Primary

  Amino amides> · CPC title

• H05K2201/0195

  Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure · CPC title

• C08G69/48

  Polymers modified by chemical after-treatment · CPC title

• H05K1/0298

  Multilayer circuits · CPC title