Multi-beam semiconductor laser device

Patent metadata

Field	Value
Publication number	US-9231374-B2
Application number	US-201414466039-A
Country	US
Kind code	B2
Filing date	Aug 22, 2014
Priority date	Aug 23, 2013
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

Provided is a multi-beam semiconductor laser device in which deterioration of element characteristics is suppressed even when a beam pitch is reduced. The multi-beam semiconductor laser device includes: a first semiconductor multilayer in which a plurality of semiconductor layers are laminated; a plurality of light emitting ridge portions that are formed on the first semiconductor multilayer; a support electrode portion formed in a region between a pair of neighboring light emitting ridge portions; and a front ridge portion formed on the front side of the support electrode portion. The support electrode portion is electrically connected to one of the pair of neighboring light emitting ridge portions. The support electrode portion is higher than the one light emitting ridge portion. An end of the front ridge portion on the front end surface side is higher than the one light emitting ridge portion at the front end surface.

First claim

What is claimed is:

1. A multi-beam semiconductor laser device, comprising:
a substrate;
a first semiconductor multilayer in which a plurality of semiconductor layers comprising an active layer are laminated on the substrate;
a plurality of light emitting ridge portions that are formed to extend along a light emitting direction from a front end surface to a rear end surface of the substrate, and to be aligned in order on an upper surface of the first semiconductor multilayer along a direction orthogonal to the light emitting direction;
a support electrode portion formed on the upper surface of the first semiconductor multilayer with an insulating film therebetween in a region between the front end surface and the rear end surface and between a pair of neighboring ones of the plurality of light emitting ridge portions; and
a front ridge portion formed on the upper surface of the first semiconductor multilayer on at a front end surface side of the support electrode portion between the pair of neighboring ones of the plurality of light emitting ridge portions,
wherein the support electrode portion is electrically connected to one of the pair of neighboring ones of the plurality of light emitting ridge portions,
wherein a height of the support electrode portion is larger than a height of the one of the pair of neighboring ones of the plurality of light emitting ridge portions, and
wherein a height of an end of the front ridge portion at the front end surface side is larger than a height of the one of the pair of neighboring ones of the plurality of light emitting ridge portions at the front end surface.

2. The multi-beam semiconductor laser device according to claim 1 , further comprising:
a rear ridge portion formed on the upper surface of the first semiconductor multilayer at a rear end surface side of the support electrode portion between the pair of neighboring ones of the plurality of light emitting ridge portions,
wherein a height of an end of the rear ridge portion at the rear end surface side is larger than a height of the one of the pair of neighboring ones of the plurality of light emitting ridge portions at the rear end surface.

3. The multi-beam semiconductor laser device according to claim 1 , further comprising:
an isolation trench formed in the upper surface of the first semiconductor multilayer between the pair of neighboring ones of the plurality of light emitting ridge portions.

4. The multi-beam semiconductor laser device according to claim 1 ,
wherein each of the plurality of light emitting ridge portions comprises a first ridge semiconductor layer formed on the upper surface of the first semiconductor multilayer, and
wherein in the one of the pair of neighboring ones of the plurality of light emitting ridge portions, a height of the first ridge semiconductor layer at the front end surface is smaller than a height thereof in an inner region.

5. The multi-beam semiconductor laser device according to claim 4 , wherein in the one of the pair of neighboring ones of the plurality of light emitting ridge portions, the support electrode portion is electrically connected above the first ridge semiconductor layer and the support electrode portion does not extend to the front end surface.

6. The multi-beam semiconductor laser device according to claim 4 ,
wherein the front ridge portion comprises a second ridge semiconductor layer formed on the upper surface of the first semiconductor multilayer, and
wherein a width of the second ridge semiconductor layer of the front ridge portion is equal to or smaller than a width of the first ridge semiconductor layer of the one of the pair of neighboring ones of the plurality of light emitting ridge portions.

7. The multi-beam semiconductor laser device according to claim 1 ,
wherein a length of the support electrode portion is 50% or more of a distance from the front end surface to the rear end surface.

8. A multi-beam semiconductor laser device, comprising:
a substrate;
a first semiconductor multilayer in which a plurality of semiconductor layers comprising an active layer are laminated on the substrate;
a plurality of light emitting ridge portions that are formed to extend along a light emitting direction from a front end surface to a rear end surface of the substrate, and to be aligned in order on an upper surface of the first semiconductor multilayer along a direction orthogonal to the light emitting direction;
a plurality of support electrode portions each formed on the upper surface of the first semiconductor multilayer with an insulating film therebetween in a region between the front end surface and the rear end surface and between pairs of neighboring ones of the plurality of light emitting ridge portions; and
a plurality of front ridge portions each formed on the upper surface of the first semiconductor multilayer at a front end surface side of one of the plurality of support electrode portions,
wherein each of the plurality of support electrode portions is electrically connected to one light emitting ridge portion of one of the pairs of the plurality of light emitting ridge portions,
wherein a height of each of the plurality of support electrode portions is larger than a height of the one of the corresponding pair of the plurality of light emitting ridge portions, and
wherein a height of an end of each of the plurality of front ridge portions at the front end surface side is larger than a height of the one of the corresponding pair of the plurality of light emitting ridge portions at the front end surface.

9. A multi-beam semiconductor laser device, comprising:
a substrate;
a first semiconductor multilayer in which a plurality of semiconductor layers comprising an active layer are laminated on the substrate;
a plurality of light emitting ridge portions that are formed to extend along a light emitting direction from a front end surface to a rear end surface of the substrate, and to be aligned in order on an upper surface of the first semiconductor multilayer along a direction orthogonal to the light emitting direction;
an isolation trench portion formed in the upper surface of the first semiconductor multilayer in a region inside the front end surface and the rear end surface between a pair of neighboring ones of the plurality of light emitting ridge portions, the isolation trench portion isolating the active layer in between the pair of neighboring ones of the plurality of light emitting ridge portions; and
a front ridge portion formed on the upper surface of the first semiconductor multilayer at a front end surface side of the isolation trench portion between the pair of neighboring ones of the plurality of light emitting ridge portions,
wherein a height of an end of the front ridge portion at the front end surface side is larger than a height of one of the pair of neighboring ones of the plurality of light emitting ridge portions at the front end surface.

10. The multi-beam semiconductor laser device according to claim 9 ,
wherein the first semiconductor multilayer further includes a clad layer laminated below the active layer,
wherein a depth of the isolation trench portion is lower than a lower surface of the active layer and the isolation trench portion reaches the clad layer.

11. The multi-beam semiconductor laser device according to claim 9 , further comprising:
a support electrode portion formed on the upper surface of the first semiconductor multilayer structure,
wherein a depth of the isolation trench portion is less than a height of the support electrode portion.

Assignees

• Oclaro Japan Inc
• Ushio Opto Semiconductors Inc

Inventors

• Inoue Yutaka
• Hara Hideki
• Usuda Shuichi

Classifications

• H01S5/04254

  characterised by the shape · CPC title

• H01S5/04256

  characterised by the configuration · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H01S5/4031

  Edge-emitting structures · CPC title

• H01S5/40

  Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30 (H01S5/50 takes precedence) · CPC title