Semiconductor memory device and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9231192-B2
Application number	US-201414147903-A
Country	US
Kind code	B2
Filing date	Jan 6, 2014
Priority date	Feb 28, 2011
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

According to one embodiment, a memory device with magnetroresistive effect element is disclosed. The element includes first metal magnetic film (MMF) with nonmagnetic element and axis of easy magnetization perpendicular (EMP), first insulating film, first intermediate magnetic film between the first MMF and the first insulating film, second MMF on the first insulating film and including nonmagnetic elements, the second MMF having axis of EMP, second intermediate magnetic film between the first insulating film and the second MMF, and diffusion preventing film including metal nitride having barrier property against diffusion of the nonmagnetic elements between the first MMF and the first intermediate magnetic film.

First claim

What is claimed is:

1. A semiconductor memory device comprising:
a semiconductor substrate; and
a magnetoresistive effect element on the semiconductor substrate,
the magnetoresistive effect element comprising:
a first metal magnetic film;
a first insulating film on the first metal magnetic film;
a second metal magnetic film on the first insulating film;
a first intermediate magnetic film between the first insulating film and the second metal magnetic film; and
a nonmagnetic metal nitride or carbide film between the first intermediate magnetic film and the second metal magnetic film,

wherein the second metal magnetic film comprises a nonmagnetic element, and the nonmagnetic element is Pt, or Pd, and the first metal magnetic film, the first insulating film, the first intermediate magnetic film, the nonmagnetic metal nitride or carbide film, and the second metal magnetic film are in line in this order.

2. The semiconductor memory device according to claim 1 , wherein the metal nitride or carbide film comprises nitride or carbide of tantalum, titanium, tungsten, molybdenum, niobium, zirconium, or hafnium.

3. The semiconductor memory device according to claim 1 , wherein each of the first and second metal magnetic films comprises a superlattice comprising the nonmagnetic element or an alloy comprising the nonmagnetic element.

4. The semiconductor memory device according to claim 1 , wherein the first insulating film is a tunnel barrier film comprising magnesium oxide.

5. The semiconductor memory device according to claim 1 , wherein the first intermediate magnetic film is configured to contact the first insulating film.

6. The semiconductor memory device according to claim 1 , wherein the magnetoresistive effect element is a MTJ (magnetic tunnel junction) element.

7. The semiconductor memory device according to claim 1 , wherein the first metal magnetic film is a recording layer, and the second metal magnetic film is a reference layer.

8. The semiconductor memory device according to claim 1 , further comprising an electrode on the second metal magnetic film and a second insulating film on the electrode.

9. The semiconductor memory device according to claim 1 , wherein the first metal magnetic film is a reference layer, and the second metal magnetic film is a recording layer.

10. The semiconductor memory device according to claim 1 , wherein the first insulating film is a crystalline insulating film.

11. The semiconductor memory device according to claim 1 , further comprising:
a second intermediate magnetic film between the first metal magnetic film and the first insulating film.

12. The semiconductor memory device according to claim 1 , wherein each of the first and second metal magnetic film has an axis of easy magnetization perpendicular to a film plane.

Assignees

• Toshiba Kk

Inventors

• Ikeno Daisuke
• Yamakawa Koji
• Natori Katsuaki
• Sonoda Yasuyuki

Classifications

• G11C11/161 Primary

  details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell · CPC title

• H01L27/226

  Electricity · mapped topic

• H01L43/08

  Electricity · mapped topic

• H01L43/02 Primary

  Electricity · mapped topic

• H10B61/20

  comprising components having three or more electrodes, e.g. transistors · CPC title