Adhesive compound and method for encapsulating an electronic arrangement

Patent metadata

Field	Value
Publication number	US-9230829-B2
Application number	US-201113992269-A
Country	US
Kind code	B2
Filing date	Nov 3, 2011
Priority date	Dec 10, 2010
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.

First claim

The invention claimed is:

1. A method for encapsulating an electronic arrangement against permeants, in which an electronic arrangement is provided on a substrate, said method comprising:
a) providing a first web material comprising the electronic arrangement on the substrate, optionally in the form of a multiplicity of individual electronic arrangements,
b) providing a second web material comprising an adhesive sheet-like structure, optionally as a continuous area or individual sheetlike diecuts disposed on a carrier,
c) providing an apparatus comprising (i) a vacuum chamber and (ii) a pair of rolls together forming a roll nip and at the same time sealing off the vacuum chamber,
d) passing the two web materials into the roll nip and into the vacuum chamber via the pair of rolls,
e) laminating the adhesive sheetlike structure with the electronic arrangement to form a resultant laminate in a vacuum in the roll nip, and
f) leading the resultant laminate away from the vacuum chamber through the roll nip of the pair of rolls.

2. The method of claim 1 , wherein the adhesive is a pressure-sensitive adhesive.

3. The method of claim 1 , wherein the adhesive is a hotmelt adhesive.

4. The method of claim 1 , wherein the vacuum is a reduced ambient pressure of not more than or equal to 800 mbar.

5. The method of claim 1 , wherein the vacuum is produced partially on the electronic arrangement and/or on the substrate.

6. The method of claim 1 , wherein the method is combined with other vacuum techniques which are used for producing electronic assemblies.

7. The method of claim 1 , wherein the electronic arrangement is provided with a thin film encapsulation prior to the laminating.

8. The method of claim 1 , wherein the vacuum is generated by raising the geographical height of the site of lamination.

9. An apparatus for encapsulating an electronic arrangement against permeants, said apparatus comprising:
a) a first web material comprising the electronic arrangement on a substrate, optionally in the form of a multiplicity of individual electronic arrangements,
b) a second web material comprising a pressure-sensitive adhesive or hotmelt-adhesive sheetlike structure, optionally as a continuous area or individual sheetlike diecuts disposed on a carrier substrate,
c) a vacuum chamber, and
d) a pair of rolls together forming a roll nip and sealing off the vacuum chamber,

wherein the apparatus is configured so that when the two web materials are passed into the vacuum chamber via the pair of rolls together forming the roll nip, said chamber is sealed off at the same time by the rolls, the two web materials are passed into the roll nip via the pair of rolls, and lamination of the pressure-sensitive adhesive or hotmelt-adhesive sheetlike structure with the electronic arrangement on the substrate to form a resultant laminate takes place in a vacuum in said roll nip, and the resultant laminate is led from the vacuum chamber through the roll nip of the pair of rolls.

10. The apparatus of claim 9 , wherein the rolls are manufactured from an elastomer or are provided with an elastomer covering, and so the rolls on their surface at room temperature have a Shore A hardness of less than 50.

Assignees

• Telgenbüscher Klaus
• Grünauer Judith
• Ellinger Jan
• Tesa Se

Inventors

• Telgenbüscher Klaus
• Grünauer Judith
• Ellinger Jan

Classifications

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/014

  using batch processing · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W74/01 Primary

  Manufacture or treatment · CPC title

• H10P72/00

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title