Conductive nanostructure, method for molding same, and method for manufacturing a field emitter using same

Patent metadata

Field	Value
Publication number	US-9230770-B2
Application number	US-201113704902-A
Country	US
Kind code	B2
Filing date	Feb 23, 2011
Priority date	Jun 17, 2010
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

The present invention relates to a conductive nanostructure, a method for molding the same, and a method for manufacturing a field emitter using the same. More particularly, the present invention relates to a field-emitting nanostructure comprising a conductive substrate, a conductive nanostructure arranged on the conductive substrate, and a conductive interfacial compound disposed in the interface between the conductive substrate and the conductive nanostructure, as well as to a method for molding the same, and a method for manufacturing a field emitter using the same.

First claim

What is claimed is:

1. A method for molding a conductive nanostructure comprising the steps of:
(a) a process for forming a conductive nanostructure arranged on a conductive substrate; and
(b) an electrical discharge machining process for the conductive nanostructure in an air environment,
wherein the step (b) comprises forming a conductive interfacial compound between the conductive substrate and the conductive nanostructure.

2. The method of claim 1 , wherein a contact resistance between the conductive substrate and the conductive nanostructure is reduced in the (b) step.

3. The method of claim 1 , wherein the conductive nanostructure includes CNT (carbon nanotube).

4. The method of claim 1 , wherein the conductive nanostructure additionally includes metal or metallic oxide.

5. The method of claim 1 , wherein the (b) step includes an electrical discharge cutting process for the conductive nanostructure to have a predetermined length.

6. The method of claim 1 , wherein the (b) step comprises:
(b1) a process for providing an electrical discharge machining electrode; and
(b2) a process for generating an electrical discharge between the conductive nanostructure and the electrical discharge machining electrode.

7. The method of claim 1 , the (b) step comprises the steps of:
(b1) a process for isolating and arranging the conductive nanostructure and the electrical discharge machining electrode in an air environment;
(b2) a process for applying a voltage between the conductive nanostructure and the electrical discharge machining electrode; and
(b3) a process for closing the conductive nanostructure to the electrical discharge machining electrode in which the voltage is applied to generate an electrical discharge.

8. The method of claim 6 , wherein the electrical discharge machining electrode is formed in a wire or cylindrical shaped.

9. The method of claim 6 , wherein the electrical discharge machining electrode is at least one selected from the group consisting of brass, graphite, silver-tungsten alloy, copper-tungsten alloy, iron, copper, zinc, phosphor bronze and aluminum or alloy thereof.

Assignees

• Kim Yong Hyup
• Kim Wal Jun
• Univ Seoul Nat R & Db Found

Inventors

• Kim Yong Hyup
• Kim Wal Jun

Classifications

• H01J1/3044

  Point emitters · CPC title

• H01J2201/30449

  Metals and metal alloys · CPC title

• B23H9/00

  Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects (heat treatment by cathodic discharge C21D1/38) · CPC title

• H01B1/08

  oxides · CPC title

• H01B1/04

  mainly consisting of carbon-silicon compounds, carbon or silicon · CPC title