MEMS device and method of manufacturing the same

US9230744B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9230744-B2
Application numberUS-201213621982-A
CountryUS
Kind codeB2
Filing dateSep 18, 2012
Priority dateJan 13, 2012
Publication dateJan 5, 2016
Grant dateJan 5, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

According to one embodiment, a MEMS element comprises a first electrode fixed on a substrate, a second electrode formed above the first electrode to face it, and vertically movable, a first anchor portion formed on the substrate and configured to support the second electrode, and a first spring portion configured to connect the second electrode and the first anchor portion. The first spring portion includes a liner layer includes a brittle material in contact with the second electrode and the first anchor portion, and a base layer formed on the liner layer, includes a brittle material having a composition different from that of the liner layer, and having a film thickness larger than that of the liner layer.

First claim

Opening claim text (preview).

What is claimed is: 1. A MEMS element comprising: a first electrode fixed on a substrate; a second electrode formed above the first electrode to face it, and vertically movable; a first anchor portion formed on the substrate and configured to support the second electrode; and a first spring portion configured to connect the second electrode and the first anchor portion, and having a step between the second electrode and the first anchor portion, wherein the first spring portion includes a liner layer comprising a brittle material in contact with the second electrode and the first anchor portion, and a base layer formed on the liner layer, comprising a brittle material having a composition different from that of the liner layer, and having a film thickness larger than that of the liner layer. 2. The element of claim 1 , wherein the base layer comprises a brittle material having an elastic constant larger than that of the liner layer. 3. The element of claim 2 , wherein the liner layer comprises one of silicon oxide and silicon oxynitride. 4. The element of claim 2 , wherein the base layer comprises one of silicon nitride, silicon oxynitride, polysilicon, silicon, silicon germanium, tungsten, molybdenum, and aluminum titanium. 5. The element of claim 2 , wherein the base layer comprises silicon nitride, and the liner layer comprises silicon oxide. 6. The element of claim 2 , wherein the base layer and the liner layer comprise silicon oxynitride, and a composition ratio of nitrogen in the base layer is higher than that of nitrogen in the liner layer. 7. The element of claim 1 , wherein the second electrode and the first anchor portion comprise a conductive ductile material. 8. The element of claim 7 , wherein the second electrode and the first anchor portion comprise one of aluminum, an alloy containing aluminum as a main component, copper, gold, and platinum. 9. The element of claim 1 , wherein the liner layer is continuously formed from an upper surface to a side surface of the first anchor portion, and from an upper surface to a side surface of the second electrode, and has equal film quality on all the surfaces. 10. The element of claim 1 , further comprising: a second anchor portion formed on the substrate and configured to support the second electrode; and a second spring portion configured to connect the second electrode and the second anchor portion, and comprising a ductile material. 11. The element of claim 10 , wherein a spring constant of the first spring portion is larger than that of the second spring portion. 12. The element of claim 10 , wherein the second spring portion comprises one of aluminum, an alloy containing aluminum as a main component, copper, gold, and platinum. 13. The element of claim 1 , wherein the base layer and the liner layer comprise silicon oxynitride, and a composition ratio of nitrogen in the base layer is higher than that of nitrogen in the liner layer.

Assignees

Inventors

Classifications

  • Electrodes · CPC title

  • H01G5/16Primary

    using variation of distance between electrodes · CPC title

  • Piezoelectric device making · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9230744B2 cover?
According to one embodiment, a MEMS element comprises a first electrode fixed on a substrate, a second electrode formed above the first electrode to face it, and vertically movable, a first anchor portion formed on the substrate and configured to support the second electrode, and a first spring portion configured to connect the second electrode and the first anchor portion. The first spring por…
Who is the assignee on this patent?
Watanabe Kei, Shimooka Yoshiaki, Saito Tomohiro, and 2 more
What technology area does this patent fall under?
Primary CPC classification H01G5/16. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 05 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).