Lens array optical coupling to photonic chip

Patent metadata

Field	Value
Publication number	US-9229169-B2
Application number	US-201113211018-A
Country	US
Kind code	B2
Filing date	Aug 16, 2011
Priority date	Aug 16, 2011
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

A photonic integrated circuit apparatus is disclosed. The apparatus includes a photonic chip and a lens array coupling element. The photonic chip includes a waveguide at a side edge surface of the photonic chip. The lens array coupling element is mounted on a top surface of the photonic chip and on the side edge surface. The coupling element includes a lens array that is configured to modify spot sizes of light traversing to or from the waveguide. The coupling element further includes an overhang on a side of the coupling element that opposes the lens array and that abuts the top surface of the photonic chip. The overhang includes a vertical stop surface that has a depth configured to horizontally align an edge of the waveguide with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide.

First claim

What is claimed is:

1. A photonic integrated circuit apparatus comprising:
a photonic chip including a waveguide that has apertures at a side edge surface of the photonic chip; and
a lens array coupling element mounted on a top surface of the photonic chip and on the side edge surface, said coupling element including a lens array configured to modify spot sizes of light traversing to or from the waveguide and including an overhang on a side of the coupling element that opposes the lens array and that abuts the top surface of the photonic chip, said overhang including a vertical stop surface that has a depth configured to horizontally align an edge of the waveguide and a surface of the lens array coupling element with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide.

2. The apparatus of claim 1 , wherein the overhang includes a second surface having a height configured to effect the vertical alignment with the focal points and the edge of the waveguide.

3. The apparatus of claim 1 , wherein the overhang further comprises at least one reference feature and wherein the top surface of the photonic chip further comprises at least one complementary feature that is aligned with said at least one reference feature and wherein said features are configured to provide a reference for lateral alignment between the focal points of the lens array and the edge of the waveguide.

4. The apparatus of claim 3 , wherein the at least one reference feature is disposed on a third surface that is above and is normal to the vertical stop surface and wherein the at least one reference feature and the at least one complementary feature are conductive pads.

5. The apparatus of claim 3 , wherein the at least one complimentary feature is at least one slot and wherein the at least one reference feature protrudes from the vertical stop surface and is disposed in the at least one complementary feature.

6. The apparatus of claim 5 , wherein the at least one reference feature includes angled sides that are configured to slide on edges of the at least one complimentary feature to act as guides for lateral alignment between the focal points of the lens array and the edge of the waveguide.

7. A photonic integrated circuit coupling system comprising:
a photonic chip including a waveguide that has apertures at a side edge surface of the photonic chip;
an other optical device configured to transmit or receive light to or from the apertures of the waveguide; and
a lens array coupling element mounted on a top surface of the photonic chip and on the side edge surface, said coupling element including a lens array configured to modify spot sizes of the light traversing between the waveguide and the other optical device, said coupling element further including an overhang on a side of the coupling element that opposes the lens array and that abuts the top surface of the photonic chip, said overhang including a vertical stop surface that has a depth configured to horizontally align an edge of the waveguide and a surface of the lens array coupling element with a focal length of the lens array and that vertically aligns focal points of the lens array with the edge of the waveguide.

8. The system of claim 7 , wherein the other optical device is a second photonic chip including a second waveguide, is a fiber array or is a laser array.

9. The system of claim 8 , wherein said other optical device includes a second lens array that is aligned with the lens array of the coupling element such that the light is collimated between the second lens array and the lens array of the coupling element.

10. The system of claim 7 , wherein the overhang further comprises at least one reference feature and wherein the top surface of the photonic chip further comprises at least one complementary feature that is aligned with said at least one reference feature and wherein said features are configured to provide a reference for lateral alignment between the focal points of the lens array and the edge of the waveguide.

11. The system of claim 10 , wherein the at least one reference feature is disposed on a third surface that is above and is normal to the vertical stop surface and wherein the at least one reference feature and the at least one complementary feature are conductive pads.

12. The system of claim 10 , wherein the at least one complimentary feature is a slot and wherein the at least one reference feature protrudes from the vertical stop surface and is disposed in the at least one complementary feature.

13. The system of claim 12 , wherein the at least one reference feature includes angled sides that are configured to slide on edges of the at least one complimentary feature to act as guides for lateral alignment between the focal point of the at least one lens and the edge of the waveguide.

14. A photonic chip coupling device comprising:
a first portion including at least one lens configured to modify a spot size of light traversing between an optical device and a waveguide that is at a side edge surface of a photonic chip and that directs light horizontally; and
a second portion on an opposing side of the coupling device with respect to the first portion, the second portion including an overhang with a first surface having a depth configured to horizontally align an edge of the waveguide and a surface of the coupling device with a focal length of the at least one lens, wherein the first surface is further configured to abut a top surface of the photonic chip and act as a vertical stop such that the overhang vertically aligns a focal point of the at least one lens with the edge of the waveguide at the side edge surface of the photonic chip.

15. The device of claim 14 , wherein the overhang includes a second surface having a height configured to effect the vertical alignment with the focal point and the edge of the waveguide.

16. The device of claim 14 , wherein the overhang further comprises at least one reference feature configured to provide a reference for lateral alignment between the focal point of the at least one lens and the edge of the waveguide.

17. The device of claim 16 , wherein the at least one reference feature is at least one conductive pad that is disposed on a third surface that is above and is normal to the first surface.

18. The device of claim 16 , wherein the at least one reference feature is on the first surface and includes a bottom surface that has a length that is equal to the depth of the first surface.

19. The device of claim 16 , wherein the at least one reference feature includes angled sides that are configured to act as guides for lateral alignment between the focal point of the at least one lens and the edge of the waveguide.

Assignees

• Doany Fuad E
• Lee Benjamin G
• Schow Clint L
• IBM

Inventors

• Doany Fuad E
• Lee Benjamin G
• Schow Clint L

Classifications

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title

• G02B6/425

  Optical features (semiconductor laser arrays H01S5/40; hybrid LED arrays H10W90/00) · CPC title

• G02B6/32 Primary

  having lens focusing means {positioned between opposed fibre ends (with lens being an integral part of the single fibre end G02B6/262)} · CPC title

• G02B6/30 Primary

  for use between fibre and thin-film device · CPC title

• G02B6/4244

  Mounting of the optical elements · CPC title