Liquid composition, and resistor film, resistor element and circuit board using same

Patent metadata

Field	Value
Publication number	US-9228100-B2
Application number	US-201113814293-A
Country	US
Kind code	B2
Filing date	Aug 4, 2011
Priority date	Aug 6, 2010
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

There is provided a liquid composition that can form a resistor exhibiting a stable resistance value. One mode of the liquid composition of the invention is a liquid composition comprising (a) an epoxy resin, (b) carbon black particles, (c) carbon nanotubes and (d) a solvent with a vapor pressure of less than 1.34×10 3 Pa at 25° C.

First claim

The invention claimed is:

1. A liquid composition comprising
(a) an epoxy resin,
(b) carbon black particles,
(c) carbon nanotubes, the carbon nanotubes having an outer diameter of 3 nm or greater and a length greater than or equal to 100 nm and less than or equal to 15 μm,
(d) a solvent with a vapor pressure of less than 1.34×10 3 Pa at 25° C., and
(e) having a viscosity allowing for discharge from an ink-jet apparatus,
wherein the content of the (c) carbon nanotubes is 0.1 to 10 parts by mass with respect to 100 parts by solid mass of the (b) carbon black particles.

2. The liquid composition according to claim 1 , wherein the mean dispersion particle size of the (b) carbon black particles is no greater than 500 nm, and the maximum dispersion particle size is no greater than 2 μm.

3. The liquid composition according to claim 1 , wherein the content of the (b) carbon black particles is 10 to 80 vol %, based on the total solid volume of the liquid composition.

4. The liquid composition according to claim 1 , wherein the viscosity is no greater than 50 mPa·s at 25° C.

5. The liquid composition according to claim 1 , wherein the (a) epoxy resin is a glycidyl etherified condensation product of a phenol and an aldehyde.

6. The liquid composition according to claim 1 , which further comprises (e) a curing agent, the (e) curing agent comprising the condensation product of a phenol and an aldehyde.

7. A resistor film formed by removing the solvent from the liquid composition according to claim 1 by heating.

8. A resistor element having the resistor film according to claim 7 .

9. A circuit board having the resistor element according to claim 8 formed on a substrate.

10. A resistor film formed by printing or coating the liquid composition according to claim 1 on a substrate to form a film of the liquid composition, and removing the solvent from the film of the liquid composition by heating.

11. A resistor element having the resistor film according to claim 10 .

12. A circuit board having the resistor element according to claim 11 formed on a substrate.

Assignees

• Kumashiro Yasushi
• Maruyama Naoki
• Inada Maki
• Hitachi Chemical Co Ltd

Inventors

• Kumashiro Yasushi
• Maruyama Naoki
• Inada Maki

Classifications

• C09D163/00

  Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins · CPC title

• C09D11/36

  based on non-aqueous solvents · CPC title

• B82Y99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H01C17/06593

  characterised by the temporary binder · CPC title

• C08K2003/045

  Chemistry & Metallurgy · mapped topic