Phenolic resin molding compound

US9228084B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9228084-B2
Application numberUS-201314080942-A
CountryUS
Kind codeB2
Filing dateNov 15, 2013
Priority dateSep 6, 2011
Publication dateJan 5, 2016
Grant dateJan 5, 2016

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A phenolic resin molding compound includes (A) a novolac-type phenolic resin including an alkylbenzene-modified novolac-type phenolic resin, (B) a resol-type phenolic resin, (C) hexamethylenetetramine, (D) graphite, and (E) fiber-shaped filler, wherein in regard to the content of each component on the basis of the entirety of the molding compound, a total content of the components (A) to (C) is 30 to 40% by weight, a content of the component (D) is 30 to 50% by weight, and a content of the component (E) is 5 to 20% by weight.

First claim

Opening claim text (preview).

What is claimed is: 1. A phenolic resin molding compound, comprising: (A) a novolac-type phenolic resin, comprising an alkylbenzene-modified novolac-type phenolic resin; (B) a resol-type phenolic resin; (C) hexamethylenetetramine; (D) graphite; and 0% of (E) fiber-shaped filler, wherein a total content of the components (A) to (C) is 30 to 40% by weight based on an entirety of the molding compound, wherein a content of the component (C) is 30 to 40 parts by weight based on 100 parts by weight of the component (A), and wherein a content of the component (D) is 30 to 50% by weight based on the entirety of the molding compound. 2. The phenolic resin molding compound according to claim 1 , wherein a content of the alkylbenzene-modified novolac-type phenolic resin in the component (A) is 20 to 30% by weight based on a total content of the components (A) and (B). 3. The phenolic resin molding compound according to claim 2 , wherein the content of the alkylbenzene-modified novolac-type phenolic resin in the component (A) is 20 to 25% by weight based on a total content of the components (A) and (B). 4. The phenolic resin molding compound according to claim 1 , wherein a modification ratio of alkylbenzene in the alkylbenzene-modified novolac-type phenolic resin is 3% by weight to 70% by weight. 5. The phenolic resin molding compound according to claim 1 , wherein in a case where a rectangular parallelepiped test specimen of 8×4×2 mm, which is obtained by injection-molding a granular molding compound at a mold temperature of 180° C. and a curing time of 15 seconds, is annealed at 160° C. for six hours and then is dipped in warm water at 80° C. for 72 hours, when a ratio of a dimension in 8 mm direction after being dipped with respect to a dimension in the 8 mm direction before being dipped is set as a dimensional change ratio, the dimensional change ratio is 0.32% or less. 6. A sliding part, comprising the phenolic resin molding compound according to claim 1 .

Assignees

Inventors

Classifications

  • C08K3/04Primary

    Carbon · CPC title

  • Six-membered rings · CPC title

  • Inorganic, e.g. non-asbestos mineral fibres · CPC title

  • of aldehydes with phenols · CPC title

  • Ingredients characterised by their shape and organic or inorganic ingredients · CPC title

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What does patent US9228084B2 cover?
A phenolic resin molding compound includes (A) a novolac-type phenolic resin including an alkylbenzene-modified novolac-type phenolic resin, (B) a resol-type phenolic resin, (C) hexamethylenetetramine, (D) graphite, and (E) fiber-shaped filler, wherein in regard to the content of each component on the basis of the entirety of the molding compound, a total content of the components (A) to (C) is…
Who is the assignee on this patent?
Sumitomo Bakelite Co
What technology area does this patent fall under?
Primary CPC classification C08K3/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jan 05 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).