Stamp face forming apparatus, stamp face forming method, and non-transitory computer-readable recording medium

Patent metadata

Field	Value
Publication number	US-9227449-B2
Application number	US-201414534040-A
Country	US
Kind code	B2
Filing date	Nov 5, 2014
Priority date	Nov 5, 2013
Publication date	Jan 5, 2016
Grant date	Jan 5, 2016

Abstract

A stamp face forming apparatus includes: a stamp face forming unit having a plurality of heating elements arranged in a direction along a surface on which a porous stamp face material being able to become nonporous by heating is held, and a drive circuit for controlling the heating states of the plurality of heating elements, the stamp face forming unit being configured to form a stamp face on the stamp face material while pressing the stamp face material; and a control unit configured to control the drive circuit of the stamp face forming unit in such a manner as to reduce the heating amount per one dot to be heated of the stamp face material in the arrangement direction of the plurality of heating elements corresponding to a decreasing length of the stamp face material in the arrangement direction of the plurality of heating elements.

First claim

What is claimed is:

1. A stamp face forming apparatus comprising:
a stamp face forming unit including a plurality of heating elements arranged in a direction along a surface on which a porous stamp face material which is able to become nonporous by heating is held, and a drive circuit for controlling heating states of the plurality of heating elements, the stamp face forming unit being configured to form a stamp face on the stamp face material while pressing the stamp face material; and
a control unit configured to control the drive circuit of the stamp face forming unit to shorten a current-carrying time for the plurality of heating elements so as to reduce a heating amount per unit area to be heated of the stamp face material in the arrangement direction of the plurality of heating elements in accordance with a decrease in length of the stamp face material in the arrangement direction of the plurality of heating elements.

2. The stamp face forming apparatus according to claim 1 , further comprising:
a current-carrying table for setting the current-carrying time for the plurality of heating elements,
wherein the control unit applies a larger correction to the current-carrying time obtained from the current-carrying table as the length of the stamp face material in the arrangement direction of the plurality of heating elements is smaller.

3. The stamp face forming apparatus according to claim 1 , wherein the control unit shortens the current-carrying time by subtracting a predetermined length of time from the current-carrying time, which is a preset value, or multiplying a predetermined ratio by the current-carrying time.

4. A stamp face forming apparatus comprising:
a stamp face forming unit including a plurality of heating elements arranged in a direction along a surface on which a porous stamp face material which is able to become nonporous by heating is held, and a drive circuit for controlling heating states of the plurality of heating elements, the stamp face forming unit being configured to form a stamp face on the stamp face material while pressing the stamp face material; and
a control unit configured to control the drive circuit of the stamp face forming unit to lower a current-carrying voltage of the plurality of heating elements so as to reduce a heating amount per unit area to be heated of the stamp face material in the arrangement direction of the plurality of heating elements in accordance with a decrease in the length of the stamp face material in the arrangement direction of the plurality of heating elements.

5. The stamp face forming apparatus according to claim 4 , wherein the control unit lowers the current-carrying voltage by subtracting a predetermined voltage value from the current-carrying voltage, which is a preset value, or multiplying a predetermined ratio by the current-carrying voltage.

6. The stamp face forming apparatus according to claim 4 , further comprising:
a current-carrying voltage table for setting the current-carrying voltage for the plurality of heating elements,
wherein the control unit applies a larger voltage correction to the current-carrying voltage obtained from the current-carrying voltage table as the length of the stamp face material in the arrangement direction of the plurality of heating elements is smaller.

7. The stamp face forming apparatus according to claim 6 , wherein the voltage offset correction is performed by subtracting a predetermined voltage value from the current-carrying voltage, which is a preset value, or multiplying a predetermined ratio value by the current-carrying voltage.

8. A stamp face forming method for forming a stamp face on a porous stamp face material which is able to become nonporous by heating, the method using a stamp face forming unit having (i) a plurality of heating elements arranged in a direction along a surface on which the stamp face material is held, and (ii) a drive circuit for controlling heating states of the plurality of heating elements, the method comprising:
moving the stamp face material relatively to the stamp face forming unit while applying heat to the stamp face material to form the stamp face; and
controlling the drive circuit of the stamp face forming unit to shorten a current-carrying time for the plurality of heating elements so as to reduce a heating amount per unit area to be heated of the stamp face material in the arrangement direction of the plurality of heating elements in accordance with a decrease in length of the stamp face material in the arrangement direction of the plurality of heating elements.

9. The stamp face forming method according to claim 8 , further comprising:
referring to a current-carrying table for setting the current-carrying time of the plurality of heating elements,
wherein in the controlling, a larger correction is applied to the current-carrying time obtained from the current-carrying table as the length of the stamp face material in the arrangement direction of the plurality of heating elements is smaller.

10. The stamp face forming method according to claim 9 , wherein the correction is performed by subtracting a predetermined length of time from the current-carrying time, which is a preset value, or multiplying a predetermined ratio by the current-carrying time.

11. A stamp face forming method for forming a stamp face on a porous stamp face material which is able to become nonporous by heating, the method using a stamp face forming unit having (i) a plurality of heating elements arranged in a direction along a surface on which the stamp face material is held, and (ii) a drive circuit for controlling heating states of the plurality of heating elements, the method comprising:
moving the stamp face material relatively to the stamp face forming unit while applying heat to the stamp face material to form the stamp face; and
controlling the drive circuit of the stamp forming unit to lower a current-carrying voltage of the plurality of heating elements so as to reduce a heating amount per unit area to be heated of the stamp face material in the arrangement direction of the plurality of heating elements in accordance with a decrease in length of the stamp face material in the arrangement direction of the plurality of heating elements.

12. The stamp face forming method according to claim 11 , wherein the current-carrying voltage is lowered by subtracting a predetermined voltage value from the current-carrying voltage, which is a preset value, or multiplying a predetermined ratio by the current-carrying voltage.

13. The stamp face forming method according to claim 11 , further comprising:
referring to a current-carrying voltage table for setting the current-carrying voltage of the plurality of heating elements,
wherein in the controlling, a larger voltage correction is applied to the current-carrying voltage obtained from the current-carrying voltage table as the length of the stamp face material in the arrangement direction of the plurality of heating elements is smaller.

14. The stamp face forming method according to claim 13 , wherein the correction is performed by subtracting a predetermined voltage value from the current-carrying voltage, which is a preset value, or multiplying a predetermined ratio by the current-carrying voltage.

15. A non-transitory computer-readable recording medium having a program stored thereon for controlling a computer to execute a stamp face forming process for forming a stamp face on a porous stamp face material which is able to become nonporous by heating, wherein the stamp face forming process uses a stamp face forming unit having (i) a plurality o

Assignees

• Casio Computer Co Ltd

Inventors

• Yuno Hirotaka

Classifications

• B41J2/315

  characterised by selective application of heat to a heat sensitive printing or impression-transfer material (B41J2/385, B41J2/435 take precedence) · CPC title

• B41K1/00 Primary

  Portable hand-operated devices without means for supporting or locating the articles to be stamped, i.e. hand stamps; Inking devices or other accessories therefor · CPC title

• B41J2/32 Primary

  using thermal heads · CPC title