Package substrate and semiconductor package including the same
US-2024429153-A1 · Dec 26, 2024 · US
Light emitting diode package
US9224935B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9224935-B2 |
| Application number | US-201514739733-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 15, 2015 |
| Priority date | May 24, 2010 |
| Publication date | Dec 29, 2015 |
| Grant date | Dec 29, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame.
First claim
Opening claim text (preview).
What is claimed is: 1. A light emitting diode (LED) package, comprising: at least one LED chip; a first lead frame and a second lead frame electrically connected to the at least one LED chip and separated by a space; and a housing disposed on the first lead frame and the second lead frame, the housing comprising: an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame; and an interna…
Assignees
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Classifications
Electricity · mapped topic
- H10W90/00Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9224935B2 cover?
- A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second…
- Who is the assignee on this patent?
- Seoul Semiconductor Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W90/00. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 29 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).