Chip packaging method, chip packaging module, and embedded substrate chip packaging structure
US-2024413138-A1 · Dec 12, 2024 · US
Semiconductor device
US9224705B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9224705-B2 |
| Application number | US-201414196316-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 4, 2014 |
| Priority date | Mar 27, 2013 |
| Publication date | Dec 29, 2015 |
| Grant date | Dec 29, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A semiconductor device includes a substrate having a plurality of electrodes and a plurality of leads that are connected to the electrodes and a semiconductor element that is mounted on the substrate. The semiconductor element has a rectangular shape including a long side, a short side, and a corner portion, and has bumps connected to the electrodes. An underfill is filled between the substrate and the semiconductor element and extends on the substrate around the semiconductor element. An overcoat covers the leads on the substrate. At least one of the plurality of leads that is connected to the electrode corresponding to the bump arranged nearest to the corner portion along the long side of the semiconductor element has at least two successive bent portions that are bent in the same direction and is laid out toward the short side of the semiconductor element in a plan view.
First claim
Opening claim text (preview).
What is claimed is: 1. A semiconductor device comprising: a substrate including a plurality of electrodes and a plurality of leads that are connected to the electrodes; a semiconductor element that is mounted on the substrate, the semiconductor element having a rectangular shape including a long side, a short side, and a corner portion, and having bumps connected to the electrodes; an underfill that is filled between the substrate and the semiconductor element and extends on t…
Assignees
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9224705B2 cover?
- A semiconductor device includes a substrate having a plurality of electrodes and a plurality of leads that are connected to the electrodes and a semiconductor element that is mounted on the substrate. The semiconductor element has a rectangular shape including a long side, a short side, and a corner portion, and has bumps connected to the electrodes. An underfill is filled between the substrate…
- Who is the assignee on this patent?
- Seiko Epson Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W74/012. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 29 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).