High temperature biasable heater with advanced far edge electrode, electrostatic chuck, and embedded ground electrode
US-2024412957-A1 · Dec 12, 2024 · US
Composite substrate for layered heaters
US9224626B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9224626-B2 |
| Application number | US-201213541006-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 3, 2012 |
| Priority date | Jul 3, 2012 |
| Publication date | Dec 29, 2015 |
| Grant date | Dec 29, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A method of forming a heater assembly for use in semiconductor processing includes thermally securing a heater substrate to an application substrate; and applying a layered heater to the heater substrate after the heater substrate is secured to the application substrate. The application of the layered heater includes applying a first dielectric layer onto the heater substrate, applying a resistive heating layer onto the first dielectric layer, and applying a second dielectric layer onto the resistive heating layer. The heater substrate defines a material having a coefficient of thermal expansion that is matched to a coefficient of thermal expansion of at least one of the first dielectric layer and a coefficient of thermal expansion of the resistive heating layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of forming a heater assembly for use in semiconductor processing comprising the following steps in sequence: thermally securing a heater substrate to an application substrate using a joining process selected from the group consisting of brazing, welding, soldering, diffusion bonding, epoxying, and vulcanizing; applying a layered heater to the heater substrate after the heater substrate is secured to the application substrate, the application of th…
Assignees
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Classifications
Electricity · mapped topic
- H10P72/0432Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
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Frequently asked questions
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- What does patent US9224626B2 cover?
- A method of forming a heater assembly for use in semiconductor processing includes thermally securing a heater substrate to an application substrate; and applying a layered heater to the heater substrate after the heater substrate is secured to the application substrate. The application of the layered heater includes applying a first dielectric layer onto the heater substrate, applying a resist…
- Who is the assignee on this patent?
- Lindley Jacob R, Meyer Dean J, Glew Alexander D, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0432. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 29 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).