Electronic component, electronic apparatus, and method for manufacturing the electronic component
US-2015116946-A1 · Apr 30, 2015 · US
Electronic component, electronic module, their manufacturing methods, mounting member, and electronic apparatus
US9220172B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9220172-B2 |
| Application number | US-201313869829-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 24, 2013 |
| Priority date | Apr 27, 2012 |
| Publication date | Dec 22, 2015 |
| Grant date | Dec 22, 2015 |
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- Title
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Abstract
Official abstract text for this publication.
A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame body. A condition α L , α F , α B <α C is satisfied, where α L is a thermal expansion coefficient of the lid body, α F is a thermal expansion coefficient of the frame body, α B is a thermal expansion coefficient of the base body, and α C is a thermal expansion coefficient of the wiring member.
First claim
Opening claim text (preview).
What is claimed is: 1. A manufacturing method of an electronic component including an electronic device and a package that houses the electronic device and is for being fixed to a wiring member by reflow soldering, the method comprising: preparing a mounting member, the mounting member being formed by bonding a base body having a center region and a peripheral region that encloses the center region of the base body, and a frame body having an opening corresponding to the center r…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9220172B2 cover?
- A method of manufacturing an electronic component includes a first step of preparing a mounting member formed by bonding a peripheral region of a base body having an outer terminal connected with a wiring member, and a frame body, while heating the base body and the frame body; a second step of fixing the electronic device to the base body; and a third step of bonding the lid body and the frame…
- Who is the assignee on this patent?
- Canon Kk
- What technology area does this patent fall under?
- Primary CPC classification H10W76/157. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 22 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).