Multi-stack nanosheet structure including semiconductor device
US-2024023326-A1 · Jan 18, 2024 · US
US9219040B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9219040-B2 |
| Application number | US-201314032484-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 20, 2013 |
| Priority date | Jun 28, 2011 |
| Publication date | Dec 22, 2015 |
| Grant date | Dec 22, 2015 |
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Official abstract text for this publication.
Methods of fabricating an integrated circuit with a fin-based fuse, and the resulting integrated circuit with a fin-based fuse are provided. In the method, a fin is created from a layer of semiconductor material and has a first end and a second end. The method provides for forming a conductive path on the fin from its first end to its second end. The conductive path is electrically connected to a programming device that is capable of selectively directing a programming current through the conductive path to cause a structural change in the conductive path to increase resistance across the conductive path.
Opening claim text (preview).
What is claimed is: 1. An integrated circuit having a fin-based fuse comprising: a semiconductor fin having a first end and a second end; a conductive path formed by a metal silicide from the first end of the semiconductor fin to the second end of the semiconductor fin; first end fin portions adjacent the first end of the semiconductor fin; second end fin portions adjacent the second end of the semiconductor fin, wherein the metal silicide covers and electrically connects t…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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