Semiconductor system and device

Patent metadata

Field	Value
Publication number	US-9219005-B2
Application number	US-201213623756-A
Country	US
Kind code	B2
Filing date	Sep 20, 2012
Priority date	Jun 28, 2011
Publication date	Dec 22, 2015
Grant date	Dec 22, 2015

Abstract

A 3D IC based mobile system including: a first semiconductor layer including first mono-crystallized transistors, where the first mono-crystallized transistors are interconnected by at least one metal layer including aluminum or copper; a second layer including second mono-crystallized transistors and overlaying the at least one metal layer, where the at least one metal layer is in-between the first semiconductor layer and the second layer; a plurality of thermal paths between the second mono-crystallized transistors and a heat removal apparatus, where at least one of the plurality of thermal paths includes a thermal contact adapted to conduct heat and not conduct electricity; and a heat spreader layer between the second layer and the at least one metal layer.

First claim

What is claimed is:

1. A 3D IC based mobile system comprising:
a first semiconductor layer comprising first mono-crystallized transistors,
wherein said first mono-crystallized transistors are interconnected by at least one metal layer comprising aluminum or copper;

a second layer comprising second mono-crystallized transistors and overlaying said at least one metal layer,
wherein said at least one metal layer is in-between said first semiconductor layer and said second laye…

Assignees

• Monolithic 3D Inc

Inventors

• Or-Bach Zvi
• Sekar Deepak
• Cronquist Brian
• Wurman Ze Ev

Classifications

• H10W74/00

  Electricity · mapped topic

• H10W72/884

  Electricity · mapped topic

• H10W74/15

  Electricity · mapped topic

• H10W90/754

  Electricity · mapped topic

• H10W46/501

  Electricity · mapped topic