Circuit package for connecting to an electro-photonic memory fabric
US-2024345316-A1 · Oct 17, 2024 · US
US9217839B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9217839-B2 |
| Application number | US-201313792790-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 11, 2013 |
| Priority date | Feb 5, 2013 |
| Publication date | Dec 22, 2015 |
| Grant date | Dec 22, 2015 |
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Disclosed are interposer structures having an optical fiber connection and a related fiber optic ferrule that can form a portion of an optical assembly. The interposer structure is useful for transmitting optical signals to/from an integrated circuit that may be attached to the interposer. Specifically, the interposer structure and the related ferrule of the optical connector provide a passively aligned structure having a matched thermal response to maintain a suitable optical connection between the devices over a range of temperatures.
Opening claim text (preview).
What is claimed is: 1. A fiber optic connector ferrule having a body, comprising: a first alignment bore having a round shape; a second alignment bore, the second alignment bore being non-round; a first plurality of optical fiber openings being disposed on a first side of the first alignment bore; and a second plurality of optical fiber openings being disposed on a second side of the first alignment bore, wherein the first plurality of optical fiber openings is directly adjacent the first alignment bore and the second alignment bore. 2. The ferrule of claim 1 , the first plurality of fiber openings and the second plurality of fiber opening being aligned along a common axis and disposed on opposite sides of the first alignment bore in a linear array. 3. The ferrule of claim 1 , the first plurality of fiber openings and second plurality of optical fiber openings being arranged in a circular array about the first alignment bore. 4. The ferrule of claim 1 , the second plurality of optical fiber openings being disposed between the first alignment bore and a periphery of the ferrule. 5. The ferrule of claim 1 being formed from a material including a filler. 6. The ferrule of claim 5 , the filler being 40 percent or more of the material. 7. The ferrule of claim 1 , further including a plurality of optical fibers attached to the ferrule to form an optical assembly. 8. The assembly of claim 7 being attached to an interposer structure. 9. The assembly of claim 8 , wherein an interposer of the interposer structure is formed from a material with a first coefficient of thermal expansion (CTE) and the ferrule is formed from a material with a second CTE, and the CTE delta between the interposer and the ferrule is 1.0×10 −6 ° C. (Δmm/mm) or less at ambient conditions. 10. The interposer structure of claim 9 , the interposer having an optical assembly attached to the connector mounting surface. 11. A fiber optic connector ferrule having a body, comprising: a first alignment bore having a round shape; a second alignment bore, the second alignment bore being non-round; a first plurality of optical fiber openings; and a second plurality of optical fiber openings, wherein the first plurality of optical fiber openings and the second plurality of optical fiber openings are disposed on a common axis and disposed on opposite sides of the first alignment bore in a linear array. 12. The ferrule of claim 11 being formed from a material including a filler. 13. The fiber optic connector ferrule of claim 12 , the optical connector ferrule being a portion of an optical assembly attached to an interposer, wherein the body of ferrule has CTE delta between the ferrule material and the interposer material of about 1.0×10 6 ° C. (Δmm/mm) at ambient conditions. 14. The ferrule of claim 12 , the filler being 40 percent or more of the material.
Assembling or joining · CPC title
for use between fibre and thin-film device · CPC title
for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles · CPC title
containing printed circuit boards [PCB] · CPC title
Reduction of thermal stress, e.g. by selecting thermal coefficient of materials · CPC title
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