Automated additive manufacturing system for printing three-dimensional parts, printing farm thereof, and method of use thereof

US9216544B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9216544-B2
Application numberUS-201313791005-A
CountryUS
Kind codeB2
Filing dateMar 8, 2013
Priority dateDec 21, 2012
Publication dateDec 22, 2015
Grant dateDec 22, 2015

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An additive manufacturing system comprising a platen assembly configured to restrain and release a film or substrate, a head gantry configured to retain a print head for printing a three-dimensional part on the restrained film or substrate. The additive manufacturing system may also include a removal assembly configured to draw the film having the printed three-dimensional part from the platen assembly and to cut the drawn film.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method for printing a three-dimensional part with an additive manufacturing system, the method comprising: securing a segment of a film to a platen assembly of the additive manufacturing system; printing an information-containing part on the secured segment of the film, wherein the information-containing part comprises encoded information relating to the three-dimensional part; printing the three-dimensional part on the secured segment of the film; releasing the secured segment of the film having the printed information-containing part and the printed three-dimensional part thereon from the platen assembly; removing the released segment of the film having the printed information-containing part and the printed three-dimensional part from the additive manufacturing system, wherein said removing comprises: drawing the released segment of the film having the printed information-containing part and the printed three-dimensional part thereon from the platen assembly to a removal assembly; and separating the drawn segment of the film having the printed information-containing part and the printed three-dimensional part thereon from a subsequent segment of the film. 2. The method of claim 1 , the method further comprising: optionally printing a support structure for the three-dimensional part on the secured segment of the film, wherein printing the information-containing part on the secured segment of the film comprises: printing the information-containing part using the same printing technique and printing material as used for printing the three-dimensional part and/or the support structure for the three-dimensional part. 3. The method of claim 2 , wherein printing the information-containing part on the secured segment of the film comprises printing the information-containing part by melt extrusion. 4. The method of claim 3 , wherein printing the information-containing part on the secured segment of the film comprises printing the information-containing part as a single-layer road. 5. The method of claim 1 , the method further comprising: encoding information with a computer system using an encoding scheme; generating, with the computer system, tool path data for the information-containing part based on the encoded information; and transmitting, with the computer system, the generated tool path data for the information-containing part to the additive manufacturing system. 6. The method of claim 1 , wherein drawing the released segment of the film comprises: engaging the film with a drive roller; operating a first motor to generate rotational power; and rotating the drive roller based on the generated rotational power from the first motor. 7. The method of claim 6 , wherein separating the drawn segment of the film comprises: operating a second motor to generate rotational power; and moving a blade unit across the film based on the generated rotational power from the second motor. 8. The method of claim 1 , wherein securing the segment of the film against the platen assembly comprises: biasing a retention bracket of the platen assembly against a surface of the platen assembly, wherein the segment of the film is pressed between the retention bracket and a portion of the surface. 9. The method of claim 8 , wherein securing the segment of the film against the platen assembly further comprises: drawing a vacuum across the surface to restrain the segment of the film against said surface. 10. A method for printing a three-dimensional part with an additive manufacturing system, the method comprising: securing a substrate to a platen assembly of the additive manufacturing system, wherein the substrate comprises a plurality of holes; printing one or more layers of a support structure on the secured substrate, wherein portions of the one or printed layers penetrate into at least a portion of the holes in a sprue-like manner to form mushroom heads that lock the support structure to the secured substrate; printing the three-dimensional part on the one or more printed layers of the support structure; releasing the substrate having the printed three-dimensional part thereon from the platen assembly; and removing the printed three-dimensional part and at least a portion of the one or more printed layers of the support structure from the substrate. 11. The method of claim 10 , wherein the substrate comprises a multi-layer substrate having interior porous regions, and wherein the mushroom heads are formed in the interior porous regions. 12. The method of claim 10 , wherein the substrate has a first surface and a second opposing surface, and wherein the plurality of holes extend through the first surface and the second opposing surface. 13. The method of claim 10 , wherein securing the substrate to the platen assembly comprises locking the substrate to the platen assembly with a plurality of hook features and hook slots. 14. The method of claim 13 , wherein the platen assembly comprises the hook slots, and the substrate comprises the hook features. 15. The method of claim 10 , wherein the substrate is derived from one or more polymeric materials, one or more paper-based materials, or combinations thereof. 16. The method of claim 10 , wherein removing the printed three-dimensional part and at least the portion of the one or more printed layers of the support structure comprises cutting the formed mushroom heads. 17. The method of claim 10 , the method further comprising: printing an information-containing part on the secured substrate, wherein the information-containing part comprises encoded information relating to the three-dimensional part. 18. The method of claim 17 , the method further comprising: encoding information with a computer system using an encoding scheme; generating, with the computer system, tool path data for the information-containing part based on the encoded information; and transmitting, with the computer system, the generated tool path data for the information-containing part to the additive manufacturing system.

Assignees

Inventors

Classifications

  • B29C64/245Primary

    Platforms or substrates (support structures intended to be sacrificed after manufacture B29C64/40) · CPC title

  • B33Y30/00Primary

    Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • Conditioning of environment · CPC title

  • Operations & Transport · mapped topic

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What does patent US9216544B2 cover?
An additive manufacturing system comprising a platen assembly configured to restrain and release a film or substrate, a head gantry configured to retain a print head for printing a three-dimensional part on the restrained film or substrate. The additive manufacturing system may also include a removal assembly configured to draw the film having the printed three-dimensional part from the platen …
Who is the assignee on this patent?
Stratasys Inc
What technology area does this patent fall under?
Primary CPC classification B29C64/245. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 22 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).