Connector devices, systems, and related methods for light emitter components

Patent metadata

Field	Value
Publication number	US-9215792-B2
Application number	US-201313839130-A
Country	US
Kind code	B2
Filing date	Mar 15, 2013
Priority date	Mar 15, 2013
Publication date	Dec 15, 2015
Grant date	Dec 15, 2015

Abstract

Connector devices and systems for light emitter components and related methods are provided. In some aspects, a connector device includes a body, at least a first trace, and a second trace. In some aspects, connector device can include multiple traces. The first and second traces can be disposed over portions of the body. In some aspects, portions of each of the first and second traces can be electrically and/or physically connectable to each of a first and a second light emitter component via an attachment material.

First claim

What is claimed is:

1. A connector device for light emitter components, the device comprising:
a body comprising a first end and a second end, wherein the first end of the body is configured to physically couple to a first light emitter board, and wherein the second end of the body is configured to physically couple to a second light emitter board for facilitating end-to-end coupling of the first light emitter board to the second light emitter board; and
at least a first trace and a second trace disposed within portions of the body;
wherein portions of each of the first and second traces are electrically and physically connectable to each of the first and second light emitter boards via an attachment material;
wherein the connector is devoid of light emitters; and
wherein the body is thinner than each of the first and the second light emitter boards to which the body is coupled.

2. The device of claim 1 , wherein the body is flexible.

3. The device of claim 1 , wherein the body comprises a thickness that is between approximately 50 μm and 150 μm.

4. The device of claim 1 , wherein the body is substantially H-shaped.

5. The device of claim 1 , wherein the body reflects light.

6. The device of claim 1 , wherein the body is white.

7. The device of claim 1 , wherein the body is coated with a wavelength conversion material.

8. The device of claim 7 , wherein the wavelength conversion material comprises a phosphor.

9. The device of claim 1 , wherein the body comprises multiple layers of material.

10. The device of claim 1 , wherein the body comprises a dielectric layer of material, a conductive layer of material, and a non-metallic reflective layer of material.

11. The device of claim 10 , wherein the dielectric layer of material comprises FR-4or related materials.

12. The device of claim 1 , further comprising multiple traces.

13. The device of claim 1 , wherein the attachment material comprises solder.

14. A method of providing a connector device for light emitter components, the method comprising:
providing a connector device, the device comprising:
a body comprising a first end and a second end, wherein the first end of the body is configured to physically couple to a first light emitter board, and wherein the second end of the body is configured to physically couple to a second light emitter board for facilitating end-to-end coupling of the first light emitter board to the second light emitter board; and
first and second traces disposed within portions of the body;
wherein portions of each of the first and second traces are electrically and physically connectable to each of the first and second light emitter boards via an attachment material; and
wherein the connector is devoid of light emitters; and

electrically connecting the connector device to the first light emitter board, wherein the body is thinner than the first light emitter board to which the body is connected.

15. The method of claim 14 , wherein providing the connector device comprises providing a body that is 100 μm or more in thickness.

16. The method of claim 14 , wherein providing the connector device comprises providing a white, reflective body.

17. The method of claim 14 , further comprising coating the body with wavelength conversion material.

18. The method of claim 14 , wherein providing the connector device comprises providing a multilayered body including a dielectric layer of material, an electrically conductive layer of material, and a non-metallic layer of material.

19. The method of claim 14 , further comprising soldering the connector device to the first light emitter component.

Assignees

• Cree Inc

Inventors

• Hussell Christopher P

Classifications

• H10H20/8506

  Containers · CPC title

• H01L2924/00

  Electricity · mapped topic

• H05K1/142

  Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit · CPC title

• H01L33/486

  Electricity · mapped topic

• Y10T29/49117

  Conductor or circuit manufacturing · CPC title