Modular electronic control unit housing system
US-2024332851-A1 · Oct 3, 2024 · US
Low profile electrical connector have a FPC
US9214747B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9214747-B2 |
| Application number | US-201313893360-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 14, 2013 |
| Priority date | May 14, 2013 |
| Publication date | Dec 15, 2015 |
| Grant date | Dec 15, 2015 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An electrical connector electrically connecting a chip module to a printed circuit board includes an insulative housing with a number of terminals therein and includes a substrate and a sidewall extending upwardly from the substrate, the substrate includes a top surface, a bottom surface opposite to the top surface and a number of through holes penetrated from the top surface to the bottom surface, wherein the electrical connector further includes a flex film located under the substrate, a frame located above the flex film and a number of solder balls electrically connecting the flex film to the printed circuit board, the four sides of the flex film and the frame are both insert-molded into the insulative housing.
First claim
Opening claim text (preview).
What is claimed is: 1. An electrical connector for electrically connecting a chip module to a printed circuit board comprising: an insulative housing with a plurality of terminals therein and comprising a base and a sidewall extending upwardly from four sides of the base; and a plurality of solder balls used for connecting the terminals to the printed circuit board; wherein the electrical connector further comprises a flex film located around a bottom portion of the base and a…
Assignees
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Classifications
- H01R12/716Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US9214747B2 cover?
- An electrical connector electrically connecting a chip module to a printed circuit board includes an insulative housing with a number of terminals therein and includes a substrate and a sidewall extending upwardly from the substrate, the substrate includes a top surface, a bottom surface opposite to the top surface and a number of through holes penetrated from the top surface to the bottom surf…
- Who is the assignee on this patent?
- Hon Hai Prec Ind Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01R12/716. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Dec 15 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).